JEDEC STANDARD Universal Flash Storage (UFS) Card Extension

1、JEDEC JESD22可靠性测试标准集 2、JEDEC JESD47 3、封装的JEDEC标准 4、JEDEC PUBLICATION 95

JESD22-B117A 2006 SOLDER BALL SHEAR BGA焊球剪切测试 JEDEC标准，由固态技术协会编制、评审，该标准国际通用，相信对集成电路行业质量管理人员和测试人员有一定帮助。

jesd标准规范，GDDR5

JEDEC标准族,各种清单，可以一目了然的看到各种标准对应的内容

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. free for $54

JEDEC标准全系列

Universal Flash Storage (UFS) Unified Memory Extension.

eMMC 4.51 JEDEC 标准，方便大家查询

The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard.