TEMPERATURE, BIAS, AND OPERATING LIFE JESD22-A108F Jul 2017

上传者: RELMATH | 上传时间: 2022-04-16 09:00:08 | 文件大小: 117KB | 文件类型: ZIP
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. free for $54

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