This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. free for $54

工业级芯片可靠性试验项目条件，分为： 1- 环境试验；2-寿命试验；3-机械试验； 均详细介绍了试验项目、试验目的、参考标准、测试条件和失效机制。 为芯片设计与测试等从业人员提供参考和标准。

完整英文电子版 IEC 60749-43：2017 Semiconductor devices – Mechanical and climatic test methods – Part 43：Guidelines for IC reliability qualification plans（半导体器件 – 机械和气候测试方法 – 第 43 部分：IC 可靠性鉴定计划指南）。IEC 60749-43:2017 给出了半导体集成电路产品 (IC) 可靠性鉴定计划的指南。 本文档不适用于军事和空间相关应用。