全志T3开发板参考设计_包含：核心板，底板，LCD板.zip

[{"title":"（ 29 个子文件 10.91MB ） 全志T3开发板参考设计_包含：核心板，底板，LCD板.zip","children":[{"title":"全志T3开发板参考设计_包含：核心板，底板，LCD板","children":[{"title":"开发板硬件","children":[{"title":"开发板硬件","children":[{"title":"核芯板","children":[{"title":"SCH","children":[{"title":"T3_MAIN_DDR3_16X2_V1_0_20160605.DSN <span style='color:#111;'> 1.62MB </span>","children":null,"spread":false},{"title":"t3_main_ddr3_16x2_v1_0_20160605.pdf <span style='color:#111;'> 514.37KB </span>","children":null,"spread":false},{"title":"t3_main_ddr3_16x2_v1_0_20160605.opj <span style='color:#111;'> 3.63KB </span>","children":null,"spread":false},{"title":"t3_main_v1_0_20160218.opj <span style='color:#111;'> 3.56KB </span>","children":null,"spread":false},{"title":"T3_MAIN_DDR3_16X2_V1_0_20160605_0.DBK <span style='color:#111;'> 1.62MB </span>","children":null,"spread":false},{"title":"T3_MAIN_V1_0_20160218_0.DBK <span style='color:#111;'> 1.60MB </span>","children":null,"spread":false}],"spread":true},{"title":"pcb","children":[{"title":"T3_MAIN_PCB20160224_V1.0.tgz <span style='color:#111;'> 4.36MB </span>","children":null,"spread":false},{"title":"T3_MAIN_PCB20160224_V1.0.eco <span style='color:#111;'> 223B </span>","children":null,"spread":false},{"title":"T3_MAIN_PCB20160224_V1.0.pcb <span style='color:#111;'> 3.73MB </span>","children":null,"spread":false}],"spread":true}],"spread":true},{"title":"LCD板","children":[{"title":"SCH","children":[{"title":"t3-lcd.opj <span style='color:#111;'> 1.32KB </span>","children":null,"spread":false},{"title":"T3-LCD.DSN <span style='color:#111;'> 434.50KB </span>","children":null,"spread":false}],"spread":true},{"title":"PCB","children":[{"title":"T3_LCD_PCB20160314_V1.0.pcb <span style='color:#111;'> 2.35MB </span>","children":null,"spread":false}],"spread":true}],"spread":true},{"title":"底板","children":[{"title":"SCH","children":[{"title":"T3_DBOARD_V1_0_20160303.ONL <span style='color:#111;'> 643.59KB </span>","children":null,"spread":false},{"title":"t3_dboard_ddr3_16x2_v1_0_20160303.opj <span style='color:#111;'> 2.72KB </span>","children":null,"spread":false},{"title":"T3_DBOARD_V1_0_20160303.asc <span style='color:#111;'> 108.08KB </span>","children":null,"spread":false},{"title":"T3_DBOARD_V1_0_20160303_0.DBK <span style='color:#111;'> 3.36MB </span>","children":null,"spread":false},{"title":"t3_dboard_v1_0_20160303.opj <span style='color:#111;'> 9.08KB </span>","children":null,"spread":false},{"title":"t3_dboard_v1_0_20160303.pdf <span style='color:#111;'> 1.45MB </span>","children":null,"spread":false},{"title":"T3_DBOARD_V1_0_20160303.DSN <span style='color:#111;'> 3.36MB </span>","children":null,"spread":false},{"title":"T3_DBOARD_V1_0_20160303.DRC <span style='color:#111;'> 333B </span>","children":null,"spread":false}],"spread":true},{"title":"PCB","children":[{"title":"signoise.run","children":[{"title":"cases.cfg <span style='color:#111;'> 80B </span>","children":null,"spread":false},{"title":"cases.cfg,1 <span style='color:#111;'> 56B </span>","children":null,"spread":false},{"title":"case1","children":null,"spread":false}],"spread":true},{"title":"allegro.jrl,1 <span style='color:#111;'> 819B </span>","children":null,"spread":false},{"title":"batch_drc.log <span style='color:#111;'> 1.36KB </span>","children":null,"spread":false},{"title":"T3_MAIN_PCB20160224_V10.brd <span style='color:#111;'> 4.71MB </span>","children":null,"spread":false},{"title":"master.tag <span style='color:#111;'> 29B </span>","children":null,"spread":false},{"title":"allegro.jrl <span style='color:#111;'> 32.21KB </span>","children":null,"spread":false},{"title":"T3_MAIN_PCB20160322_V1.0.pcb <span style='color:#111;'> 10.84MB </span>","children":null,"spread":false},{"title":"T3_MAIN_PCB20160322_V1.0.eco <span style='color:#111;'> 105B </span>","children":null,"spread":false}],"spread":true}],"spread":true}],"spread":true}],"spread":true}],"spread":true}],"spread":true}]