一款小、快、精多个优点，计算PCB层叠构的小工具，很好用且很实用

在设计多层PCB 电路板之前，设计者需要首先根据电路的规模、电路板的尺寸和电磁兼容 （EMC）的要求来确定所采用的电路板结构，也就是决定采用4 层，6 层，还是更多层数的 电路板。确定层数之后，再确定内电层的放置位置以及如何在这些层上分布不同的信号。这 就是多层PCB 层叠结构的选择问题。层叠结构是影响PCB 板EMC 性能的一个重要因素，也 是抑制电磁干扰的一个重要手段。本节将介绍多层PCB 板层叠结构的相关内容

Oscar 物联网开发板 基于GD32F130C8T6为主控设计的物联网开发板，板载丰富的芯片/模块，涵盖了UART/SPI/I2C/ADC等外设接口，通过学习使用Oscar 开发板，用户可快速入门GD32F130系列芯片的基础操作； ESP8285 Wi-Fi 模块 CP2102 USB串口 电压电流测量电路 128kb 串行Flash 3.2寸SPI串行TFT 液晶触摸屏 2个按键，可唤醒主控 小型贴片蜂鸣器 USB供电过流保护设计 项目开源资料： 硬件外观

附件内容包括功率计硬件设计+源代码以及答辩PPT。里边有参数的详细分享，论文就不放了，虽然不是什么高端东西，但是很反感直接抄袭的行为 。我觉得放上来的主要意义就是，给初学者一个状态机编程、宏定义、数据处理优化、DMA中断高速数据采集等的一个应用实例。 这里有个问题没有很好的解决，就是电压电流通道数据有时候会串位（引起的原因是关闭重新开启了AD及DMA），但是对功率测量的影响不大。 测量数据为瞬时功率p、平均功率P和消耗的总功W。不妨说，测量精度不是太高，最好只达到了0.1W（小功率测量），误差原因ppt里有简单分析，当然在测量方案的选取上肯定也存在不足。 该功率计电路设计涉及到的重要芯片包括:STM32F103RBT6、AD780、TL071、LTC6101等。 功率计电路截图: 程序总体流程图 实物图片展示:

智能优化算法、神经网络预测、信号处理、元胞自动机、图像处理、路径规划、无人机等多种领域的Matlab仿真

集成了所有的protel99se PCB库文件

电子密码锁-带源程序电路图和pcb.rar

Altium Designer AD 封装库 常用线路板PCB库 带3D模型 ssop芯片封装库 常用封装

cadence16.2 PCB入门中文教程

Preface Printed Circuit Board Design Techniques for EMC Compliance: A Handbook for Designers, Second Edition, is a significant enhancement to the first edition. The first edition was well received within the engineering community worldwide and was translated into international languages. The intent of the present volume is to expand upon concepts presented in the earlier edition, to justify why a specific design technique works, and to show when it is appropriate for use. Additional techniques based on technological changes within the last few years are also incorporated. These techniques and enhancements are based on questions, comments, and discussions received from engineers around the world. This book presents information never before published within the engineering community, dealing exclusively with printed circuit boards (PCBs). When writing the first edition, it was impossible to anticipate the amount of variations possible, or what the intended audience expected from a book directed toward nondegreed engineers. A thorough understanding of the concepts presented herein will assist during the design and layout process. Note the key word here —"concepts." Printed Circuit Board Design Techniques for EMC Compliance will help minimize the emission or reception of unwanted radio frequency (RF) energy generated by components and circuits, thus achieving acceptable levels of electromagnetic compatibility (EMC) for electrical equipment. The field of EMC consists of two distinct areas: 1. Emissions: Propagation of electromagnetic interference (EMI) from noncompliant devices (culprits) and, in particular, radiated and conducted electromagnetic interference. 2. Susceptibility or immunity: The detrimental effects on susceptible devices (victims) in forms that include EMI, electrostatic discharge (ESD), and electrical overstress (EOS). The primary goal of the engineer is to ensure proper operation and performance of a product when used within an intended electromagnetic environment. These design requirements are in addition to making a product function as desired for use within a specific, end-use environment. Information presented in this guideline is intended for those who design and layout printed circuit boards. EMC and compliance engineers will also find the information presented herein helpful in solving design problems at both the PCB and system level. This book can be used as a reference document for any design project. The focus of this book is strictly on the PCB. Containment techniques (shielding), internal and external cabling, power supply design, and other system-level subassemblies that use PCBs as a subcomponent will not be discussed. Again, as in the first edition, excellent reference material on these aspects of EMC system-level engineering is listed in the References section at the ends of chapters.