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Preface
Printed Circuit Board Design Techniques for EMC Compliance: A
Handbook for Designers, Second Edition, is a significant enhancement to
the first edition. The first edition was well received within the engineering
community worldwide and was translated into international languages. The
intent of the present volume is to expand upon concepts presented in the
earlier edition, to justify why a specific design technique works, and to
show when it is appropriate for use. Additional techniques based on
technological changes within the last few years are also incorporated.
These techniques and enhancements are based on questions, comments,
and discussions received from engineers around the world.
This book presents information never before published within the
engineering community, dealing exclusively with printed circuit boards
(PCBs). When writing the first edition, it was impossible to anticipate the
amount of variations possible, or what the intended audience expected
from a book directed toward nondegreed engineers. A thorough
understanding of the concepts presented herein will assist during the
design and layout process. Note the key word here —"concepts."
Printed Circuit Board Design Techniques for EMC Compliance will help
minimize the emission or reception of unwanted radio frequency (RF)
energy generated by components and circuits, thus achieving acceptable
levels of electromagnetic compatibility (EMC) for electrical equipment. The
field of EMC consists of two distinct areas:
1. Emissions: Propagation of electromagnetic interference (EMI) from
noncompliant devices (culprits) and, in particular, radiated and
conducted electromagnetic interference.
2. Susceptibility or immunity: The detrimental effects on susceptible
devices (victims) in forms that include EMI, electrostatic discharge
(ESD), and electrical overstress (EOS).
The primary goal of the engineer is to ensure proper operation and
performance of a product when used within an intended electromagnetic
environment. These design requirements are in addition to making a
product function as desired for use within a specific, end-use environment.
Information presented in this guideline is intended for those who design
and layout printed circuit boards. EMC and compliance engineers will also
find the information presented herein helpful in solving design problems at
both the PCB and system level. This book can be used as a reference
document for any design project.
The focus of this book is strictly on the PCB. Containment techniques
(shielding), internal and external cabling, power supply design, and other
system-level subassemblies that use PCBs as a subcomponent will not be
discussed. Again, as in the first edition, excellent reference material on
these aspects of EMC system-level engineering is listed in the References
section at the ends of chapters.