MTBF即平均无故障时间，英文是“Mean Time Between Failure”，具体是指产品从一次故障到下一次故障的平均时间，是衡量一个产品的可靠性指标(仅用于发生故障经修理或更换零件能继续工作的设备或系统)，单位为“小时”。 MTBF值的计算方法，目前最通用的权威性标准是MIL-HDBK-217(美国国防部可靠性分析中心及Rome实验室提出并成为行业标准，专门用于军工产品)、GJB/Z299B(中国军用标准)和Bellcore(AT&T Bell实验室提出并成为民用产品MTBF的行业标准)。

MIL-HDBK-217F（N1） MIL-HDBK-217F

MIL-HDBK-217F, Notice 1 is issued to correct minor typographical errors in the basic F Revision. MIL HDBK-217F(base document) provides the following changes based upon recently completed studies (see Ret 30 and 32 listed in Appendix C) 1. New failure rate prediction models are provided for the following nine major classes of microcircuits Monolithic Bipolar Digital and Linear Gate/Logic Array Devices Monolithic MOS Digital and Linear Gate/Logic Array Devices Monolithic Bipolar and MOS Digital Microprocessor Devices(Including Controllers Monolithic Bipolar and Mos Memory Devices Monolithic GaAs Digital Devices Monolithic GaAs MMIC Devices Hybrid Microcircuits Magnetic Bubble Memories Surface Acoustic Wave Devices This revision provides new prediction models for bipolar and Mos microcircuits with gate counts up to 60,000, linear microcircuits with up to 3000 transistors, bipolar and Mos digital microprocessor and co- processors up to 32 bits, memory devices with up to 1 million bits, GaAs monolithic microwave integrated circuits(MMICs)with up to 1,000 active elements, and GaAs digital ICs with up to 10,000 transistors. The C, factors have been extensively revised to reflect new technology devices with improved reliability, and the activation energies representing the temperature sensitivity of the dice(IT)have been changed for MOS devices and for memories. The Ca factor remains unchanged from the previous Handbook version, but includes pin grid arrays and surlace mount packages using the same model as hermetic, solder-sealed dual in-line packages. New values have been included for the quality factor (o), the learning factor(i, and the environmental factor(aE). The model for hybrid microcircuits has been revised to be simpler to use, to delete the temperature dependence of the seal and interconnect fallure rate contributions, and to provide a method of calculating chip junction temperatures 2. A new model for Very High Speed Integrated Circuits(VHSIC/HSIC Like)and very

MTBF的计算标准MIL-HDBK-217F 美军标

美国电子产品可靠性预计手册,产品可靠性预计和分析是产品研发过程的重要工作项目。它对于产品设计的可行性决策、部件的选择和使用、产品的维修策略以及整个综合后勤保障要求的制定等都是非常关键的。