IC封装工艺设计

[{"title":"（ 10 个子文件 27.21MB ） IC封装工艺设计","children":[{"title":"2012封装PPT","children":[{"title":"底冲胶技术.ppt <span style='color:#111;'> 883.00KB </span>","children":null,"spread":false},{"title":"基板技术 .ppt <span style='color:#111;'> 1.03MB </span>","children":null,"spread":false},{"title":"2006集成电路失效分析6.ppt <span style='color:#111;'> 381.00KB </span>","children":null,"spread":false},{"title":"封装基本工艺2.ppt <span style='color:#111;'> 3.09MB </span>","children":null,"spread":false},{"title":"2006集成电路失效分析8.ppt <span style='color:#111;'> 121.50KB </span>","children":null,"spread":false},{"title":"无铅焊料.ppt <span style='color:#111;'> 565.50KB </span>","children":null,"spread":false},{"title":"2006集成电路失效分析1-1.ppt <span style='color:#111;'> 3.77MB </span>","children":null,"spread":false},{"title":"键合技术.ppt <span style='color:#111;'> 4.03MB </span>","children":null,"spread":false},{"title":"积层多层板制作工艺.ppt <span style='color:#111;'> 9.83MB </span>","children":null,"spread":false},{"title":"新型封装技术.ppt <span style='color:#111;'> 6.63MB </span>","children":null,"spread":false}],"spread":true}],"spread":true}]