[{"title":"( 9 个子文件 1.07MB ) COMSOL热流,热流固拓扑优化流道双目标模型(平均温度和压降)\ncomsol拓扑优化代做,学位文献复现\n目标函数为:设计域最大热+最小流动耗散\n控制方程为无量纲形式或常规形式,拓扑优化等\n\n,CO","children":[{"title":"2.jpg <span style='color:#111;'> 111.50KB </span>","children":null,"spread":false},{"title":"热流热流固拓扑优化流道双目标模型平.html <span style='color:#111;'> 514.78KB </span>","children":null,"spread":false},{"title":"1.jpg <span style='color:#111;'> 72.41KB </span>","children":null,"spread":false},{"title":"基于的热流固拓扑优化流道双目标模型平均温度.html <span style='color:#111;'> 515.16KB </span>","children":null,"spread":false},{"title":"基于的热流固拓扑优化研究双目标.docx <span style='color:#111;'> 16.53KB </span>","children":null,"spread":false},{"title":"基于的热流固拓扑优化流道双目标模.docx <span style='color:#111;'> 16.61KB </span>","children":null,"spread":false},{"title":"3.jpg <span style='color:#111;'> 95.06KB </span>","children":null,"spread":false},{"title":"4.jpg <span style='color:#111;'> 85.49KB </span>","children":null,"spread":false},{"title":"基于的热流固拓扑优化流道双目标模型研究一引言.docx <span style='color:#111;'> 16.69KB </span>","children":null,"spread":false}],"spread":true}]