1. INTRODUCTION............................................................................................................... 46 1.1. A THIRD GENERATION I/O INTERCONNECT ................................................................... 46 1.2. PCI EXPRESS LINK......................................................................................................... 49 1.3. PCI EXPRESS FABRIC TOPOLOGY .................................................................................. 50 1.3.1. Root Complex........................................................................................................ 50 1.3.2. Endpoints .............................................................................................................. 51 1.3.3. Switch .................................................................................................................... 54 1.3.4. Root Complex Event Collector .............................................................................. 55 1.3.5. PCI Express to PCI/PCI-X Bridge........................................................................ 55 1.4. PCI EXPRESS FABRIC TOPOLOGY CONFIGURATION ....................................................... 55 1.5. PCI EXPRESS LAYERING OVERVIEW.............................................................................. 56 1.5.1. Transaction Layer ................................................................................................. 57 1.5.2. Data Link Layer .................................................................................................... 57 1.5.3. Physical Layer ...................................................................................................... 58 1.5.4. Layer Functions and Services............................................................................... 58 TRANSACTION LAYER SPECIFICATION ................................................................. 62 2.1. TRANSACTION LAYER OVERVIEW.................................................................................. 62 2.1.1. Address Spaces, Transaction Types, and Usage................................................... 63 2.1.2. Packet Format Overview ...................................................................................... 65 2.2. TRANSACTION LAYER PROTOCOL - PACKET DEFINITION............................................... 67 2.2.1. Common Packet Header Fields ............................................................................ 67 2.2.2. TLPs with Data Payloads - Rules ......................................................................... 70 2.2.3. TLP Digest Rules .................................................................................................. 74 2.2.4. Routing and Addressing Rules .............................................................................. 74 2.2.5. First/Last DW Byte Enables Rules........................................................................ 78 2.2.6. Transaction Descriptor ......................................................................................... 81 2.2.7. Memory, I/O, and Configuration Request Rules................................................... 87 2.2.8. Message Request Rules ......................................................................................... 94 2.2.9. Completion Rules ................................................................................................ 115 2.2.10. TLP Prefix Rules ................................................................................................. 118 2.3. HANDLING OF RECEIVED TLPS.................................................................................... 123 2.3.1. Request Handling Rules...................................................................................... 126 2.3.2. Completion Handling Rules................................................................................ 138 2.4. TRANSACTION ORDERING ............................................................................................ 142 2.4.1. Transaction Ordering Rules ............................................................................... 142 ......
2022-12-08 17:33:08 10.59MB pcie 4.0 标准
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nanodet source file and version for pytorch
2022-12-08 11:28:22 15.55MB 深度学习
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IBIS I/O Buffer Information Specification Version 4.1
2022-12-01 16:28:42 396KB IBIS I/O Buffer Information
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Permanent Reference Document NAPRD03 Version 6.10 September 202 This section of NAPRD03 specifies a common approach to the certification testing of GSM/UTRA/E-UTRA/NR wireless devices (referred to as “Devices” throughout this document). The intent of this document is to define the criteria such that certification testing of Devices may be performed on a consistent basis. This document is maintained by the PTCRB Working Group within CTIA Certification LLC and is updated on a quarterly basis.
2022-11-28 19:21:06 227KB ptcrb permantreferenc
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自微软36719年以来,在Windows 7于2020年1月14日完成技术开发后,许多用户将其用于Windows 10。除了Windows 7更漂亮之外,Windows 10还有很多工作要做,使用这些小功能很好。 所以,让我们来谈谈这个问题。相信手术中的很多人,有各种各样的垃圾清理36719;例如,360,电块茎等等。但我想告诉你一个秘密:你的大脑不需要清理36719,因为这些简单的事情可以由系统自己完成,清理污垢更安全。;第一是第三可靠的垃圾清理器36719;在这种情况下,清洁垃圾处理过程中没有完整的垃圾文件和可用信息,提供了21024;提供了36719;通常不起作用。因此,在这种情况中,您不需要使用第三次垃圾清理36719;来清理垃圾,特别是在工作场所或大学。
2022-11-28 17:01:47 809B 清理
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adb mac version
2022-11-25 13:21:44 12.18MB adb
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adb linux version
2022-11-25 10:20:55 6.95MB android adblinux
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GX Works2 Version 1操作手册(公共篇).pdf
2022-11-21 09:54:31 21.05MB 三菱PLC
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EDA工具 Verdi User Guide and Tutorial,Version L-2016.06
2022-11-17 12:17:30 30.15MB eda verdi verdi2016 userguide
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App: OneDrive Version: 6.68 (Beta 3) (2026680332) Languages: 100 Package: com.microsoft.skydrive 95.57 MB (100,216,508 bytes) Supports installation on external storage. Min: Android 6.0 (Marshmallow, API 23) Target: Android 11 (API 30) arm64-v8a nodpi Permissions: 30features: 6libraries: 3 Uploaded November 11, 2022 at 12:36AM UTC by Microsoft Corporation
2022-11-13 16:21:49 95.57MB 手机软件 网盘
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