Reliability engineering theory and practice 可靠性理论工程 This book shows how to build in and assess reliability, availability, maintainability, and safety (RAMS) of components, equipment & systems.

Product failure Reliability Analysis using Minitab

信赖边缘 Reliance Edge是一个小型，便携式，高度可靠的断电安全文件系统，用于资源受限的嵌入式系统（如微控制器）。 它是用C编写的，并提供了类似POSIX的文件系统API，使它易于在您的应用程序中使用。 如果您的应用程序具有简单的存储需求，则可以使用替代的简约API。 Reliance Edge是高度可配置的，可以根据您的应用程序的确切需求进行调整。 获得帮助 您也可以在我们的自述文件中找到本节，但我们想提前告诉您：TUXERA希望听到您的声音！ 无论是对产品发表评论，建议新功能还是告诉我们您不满意的地方，请与我们联系！ 所有评论和查询都可以直接发送至 。 文献资料 Reliance Edge的完整文档是单独分发的。 它包括API参考和使用Reliance Edge各个方面的详细讨论，包括移植，构建，配置和测试。 可以从以下位置免费获得称为“开发人员指南”的完整文档： 除此自述

Reliability Prediction of Electronic Equipment MIL-HDBK-217F

不可多得的好资料 高分下载过来的 分享给大家 google运维技术解密

可靠性 用于可靠性分析的Python类，包括Monte Carlo和FORM方法。 显示了一些应用示例。 该项目仍在开发中。

Analog IC Reliability in Nanometer CMOS-2013 [206]

利用蒙特卡洛计算结构可靠度，文中的变量为非正态。

Authors: Dana Crowe & Alec Feinberg 1. Reliability Science 1.1 Introduction 1.2 Reliability Design: “A Stage Gate Approach” 1.3 Design for Reliability Tools 1.4 Reliability Verification 1.5 Analytical Physics 1.6 The Goal Is Customer Satisfaction 2. Understanding Customer Requirements 2.1 Introduction 2.2 Specified and Unspecified Requirements 2.3 Cost of Reliability 2.4 Benchmarking 2.5 Using Failure Modes and Effects Analysis to Meet Customer Requirements 3. Design Assessment Reliability Testing 3.1 Introduction 3.2 Four-Corner HALT Testing 3.3 Design Assessment Reliability Testing at the Hybrid and Component Level 3.4 Summary 4. Design Maturity Testing (DMT) 4.1 Introduction 4.2 Overview of DMT Planning 4.3 DMT Reliability Objectives 4.4 DMT Methods 4.5 Reliability and Sampling Distribution Models 4.6 Sample Size Planning 4.7 Automated Accelerated Test Planning 4.8 DMT Methodology and Guidelines References 5. Screening and Monotoring 5.1 Introduction 5.2 Achieving Reliability Growth in a Screening Program 5.3 Monitoring and Screening Tools 5.4 Highly Accelerated Stress Screening (HASS)Section II: Supporting Stage Gate Authors: Carl Bunis & Peter Ersland 6. Semiconductor Process Reliability 6.1 Introduction 6.2 Overview of Semiconductor Process Reliability Studies in the GaAs Industry 6.3 Wafer Level Reliability Tests 6.4 Summary References 7. Analytical Physics 7.1 Introduction 7.2 Physics of Failure 7.3 Analysis Flow 7.4 Failure Analysis Example 7.5 Analytical Techniques References Section III: Topics in Reliability Authors: Dana Crowe & Alec Feinberg 8. Reliability Statistics Simplified 8.1 Introduction 8.2 Definitions and Reliability Mathematics 8.3 Failure Rate Concepts 8.4 Reliability Models 8.5 Reliability Objectives and Confidence Testing 8.6 Parametric and Catastrophic Methods 8.7 Influence of Acceleration Factors on Test Planning References Appendix A – AT&T and Common Weibull Model Comparisons Appendix B – Helpful Microsoft® Excel Functions 9. Concepts in Accelerated Testing 9.1 Introduction 9.2 Common Sense Guidelines for Preventing Anomalous Accelerated Testing Failures 9.3 Time Acceleration Factor 9.4 Applications to Accelerated Testing 9.5 High-Temperature Operating Life Acceleration Model 9.6 Temperature-Humidity-Bias Acceleration Model 9.7 Temperature Cycle Acceleration Model 9.8 Vibration Acceleration Model 9.9 Electromigration Acceleration Model 9.10 Failure-Free Accelerated Test Planning 9.11 Step-Stress Testing 9.12 Describing Life Distributions as a Function of Stress 9.13 Summary References10. Accelerated Reliability Growth 10.1 Introduction 10.2 Estimating Benefits with Reliability Growth Fixes 10.3 Accelerated Reliability Growth Methodology 10.4 Applying Accelerated Reliability Growth Theory 10.5 Assessing Reliability Growth 10.6 Summary References Appendix – Accelerated Reliability Growth Stage Gate Model 11. Reliability Predictive Modeling 11.1 Introduction 11.2 System Reliability Modeling 11.3 Customer Expectations 11.4 Various Methods 11.5 Common Problems References Appendix A – Tabulated k of n System Effective Failure Rates Appendix B – Redundancy Equation with and without Repair Appendix C – Availability 12. Failure Modes and Effects Analysis 12.1 Failure Modes and Effects Analysis 12.2 FMEA Goal and Vision 12.3 FMEA Concepts 12.4 Types of FMEA Evaluations 12.5 Objectives 12.6 An FMEA Example 12.7 Implementation Methods Appendix A – Guide to Assigning FMEA Key Criteria Appendix B – FMEA Forms 13. Evaluating Product Risk 13.1 Introduction 13.2 Goals of a Risk Program 13.3 Managing Risks for Your Program 13.4 Four Steps to Risk Management 13.5 Guidelines for Risk Planning (Step 1) 13.6 Guidelines for Risk Assessment (Step 2) 13.7 Guidelines for Risk Analysis (Step 3) 13.8 Guidelines for Risk Handling (Step 4) 14. Thermodynamic Reliability Engineering 14.1 Thermodynamics and Reliability Engineering 14.2 The System and Its Environment 14.3 The Aging Process 14.4 Aging Due to Cyclic Force 14.5 Corrosion and Activation 14.6 Diffusion 14.7 Transistor Aging of Key Device Parameters 14.8 Understanding Logarithmic-in-Time Parametric Aging Associated with Activated Processes 14.9 Summary References

在新一代的集成模块化航空电子系统中，机载软件采用开放的分布式架构，其中模块共享各种公共资源，并且彼此之间进行复杂的交互，从而导致模块故障易于传播，因此可靠性高。机载软件可能会减少。 机载软件的分析，测量和改进已成为需要解决的重要问题。 针对机载分布式软件的特点，提出了一种基于AADL的误差建模和可靠性分析方法。 利用AADL体系结构模型中的关键信息，可以生成AADL错误模型来描述机载分布式软件的故障行为。 在此步骤的基础上，使用灵敏度分析方法来分析系统可靠性。 因此，设计人员可以在开发的早期阶段找到影响系统可靠性的关键模块，从而在决策的基础上提高系统的可靠性。