Head First Java, 2nd Edition 中文版 网上找了很久才找到，只找到一个中文版的，英语ＰＤＦ做得不错，这个中文的勉强能看。
2022-01-20 22:11:05
18.04MB
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一阶局部无序注册_First Order Locally Orderless Registration.pdf
2022-01-20 17:01:42
642KB
Head.First.design.patterns-中文超清.pdf Head.First.design.patterns-中文超清.pdf
2022-01-20 16:32:27
119.42MB
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Table of Contents
1. Grounding and Planes...................................................................................................... 7
1.1 Filters ............................................................................................................................ 7
1.2 Routing ......................................................................................................................... 8
1.3 Plane slots and boundaries .......................................................................................... 9
1.4 Decoupling capacitors ................................................................................................ 10
1.5 Power Distribution Network Impedance .................................................................... 11
2. High Speed Considerations ............................................................................................ 13
2.1 Identifying High Speed Signals ................................................................................... 13
2.2 Impedance .................................................................................................................. 14
2.2.1 Single Ended Characteristic Impedance ............................................................. 15
2.2.2 Differential Impedance ....................................................................................... 16
2.3 Terminations............................................................................................................... 18
2.3.1 Single Ended Terminations ................................................................................. 18
2.3.2 Differential Terminations ................................................................................... 20
2.4 Placement ................................................................................................................... 22
2.4.1 Partitioning ......................................................................................................... 22
2.4.2 Zoning ................................................................................................................. 22
2.4.3 Analog Buffers .................................................................................................... 23
2.5 Routing ....................................................................................................................... 24
2.5.1 Topology ............................................................................................................. 24
2.5.2 Bus Routing ......................................................................................................... 26
2.5.3 Corners ............................................................................................................... 28
2.5.4 Vias ..................................................................................................................... 28
2.5.5 Differential Routing ............................................................................................ 28
2.5.6 Proximity to Board Edge ..................................................................................... 30
2.6 Signal Timing ............................................................................................................... 31
2.6.1 Identifying time-critical signals ........................................................................... 31
2.6.2 Propagation time ................................................................................................ 32
2.6.3 Eye diagram analysis .......................................................................................... 32
2.7 Oscillators / Crystals ................................................................................................... 33
3. Crosstalk ......................................................................................................................... 35
3.1 Identifying Victims and Aggressors ........................................................................ 35
3.2 Layer Assignment ................................................................................................... 35
3.3 Orthogonality ......................................................................................................... 36
3.4 Parallelism .............................................................................................................. 36
3.5 Guarding ................................................................................................................. 37
3.6 Return paths ........................................................................................................... 38
3.7 Receiver Placement ................................................................................................ 39
4. EMC Considerations ....................................................................................................... 42
4.1 General Considerations .............................................................................................. 42
4.2 Components ............................................................................................................... 42
4.2.1 Component selection ......................................................................................... 43
4.2.2 High speed filters ................................................................................................ 43
4.2.3 Unused pins ........................................................................................................ 44
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Copyright © 2014 EMC FastPass
4.2.4 Heatsinks ............................................................................................................ 44
4.2.5 Shielded components ......................................................................................... 44
4.3 Power Supply .............................................................................................................. 45
4.3.1 Mains .................................................................................................................. 45
4.3.2 Voltage regulators .............................................................................................. 45
4.3.3 Switching mode power supplies ......................................................................... 46
4.4 Routing ....................................................................................................................... 47
4.4.1 Clock distribution ................................................................................................ 47
4.4.2 Guarding ............................................................................................................. 48
4.4.3 Stubs ................................................................................................................... 49
4.5 System design ............................................................................................................. 49
4.5.1 Chassis grounding ............................................................................................... 49
4.5.2 Cables ................................................................................................................. 50
4.5.3 Connectors ......................................................................................................... 51
4.6 ESD & Safety ............................................................................................................... 52
4.6.1 Connectors ......................................................................................................... 52
4.6.2 Sensitive pins .......................................................................................................... 54
4.6.3 High Voltage ........................................................................................................... 54
5. Design for Test ............................................................................................................... 55
5.1 Test Points .................................................................................................................. 55
5.2 Tooling Pins ................................................................................................................ 55
5.3 Push fingers ................................................................................................................ 56
5.4 Sealing ........................................................................................................................ 56
5.5 AOI .............................................................................................................................. 56
6. Design for Manufacture ................................................................................................. 57
6.1 Stackup ....................................................................................................................... 57
6.1.1 Symmetry ........................................................................................................... 57
6.1.2 Drill pairs ............................................................................................................. 57
6.1.3 Copper balance ................................................................................................... 58
6.2 Design Rules Check ..................................................................................................... 59
6.2.1 Clearance ............................................................................................................ 59
6.2.2 Width .................................................................................................................. 60
6.2.3 Annular Ring ....................................................................................................... 60
6.2.4 Slivers .................................................................................................................. 60
6.2.5 Acid Traps ........................................................................................................... 61
6.2.6 Silkscreen Over Pads ........................................................................................... 62
6.3 Mechanical ................................................................................................................. 62
6.3.1 Mechanical Drawings ......................................................................................... 62
6.3.2 Drill Drawings ..................................................................................................... 63
6.3.3 Slots .................................................................................................................... 63
6.3.4 Mounting holes .................................................................................................. 64
6.3.5 Panelization ........................................................................................................ 64
6.3.6 PCB manufacturing specifications ...................................................................... 65
6.4 Assembly Considerations ........................................................................................... 66
6.4.1 Assembly Flow .................................................................................................... 66
6.4.2 Stencils ................................................................................................................ 66
6.4.3 Panelized Assembly ............................................................................................ 67
6.4.4 Decals ................................................................................................................. 67
6.4.5 Fiducials .............................................................................................................. 68
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6.4.6 Thermal Relief .................................................................................................... 69
6.4.7 Assembly drawings and BOM ............................................................................. 69
6.4.8 PCB Assembly Specifications .............................................................................. 70
6.5 Manufacturing files .................................................................................................... 71
6.5.1 Gerber ................................................................................................................. 71
6.5.2 NC Drill ................................................................................................................ 71
6.5.3 Pick & Place ........................................................................................................ 71
6.5.4 Test Point Report ................................................................................................ 71
7. Thermal considerations ................................................................................................. 72
7.1 Power Dissipation ....................................................................................................... 72
7.2 Heatsinks .................................................................................................................... 72
7.3 Cooling Areas .............................................................................................................. 73
7.4 Current Carrying Capacity .......................................................................................... 73
8. Helpful Utilities .............................................................................................................. 75
8.1 IPC7351 Land Pattern Calculator ................................................................................ 75
8.2 PCB Fabrication Wall Chart ......................................................................................... 75
8.3 PCB Calculators ........................................................................................................... 75
8.4 Filter Selection Simulator ........................................................................................... 76
8.5 Circuit Simulation Tools ...........................................................
2022-01-18 09:32:55
2.48MB
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Wouldn't it be great if there were a physics book that showed you how things work instead of telling you how? Finally, with Head First Physics, there is. This comprehensive book takes the stress out of learning mechanics and practical physics by providing a fun and engaging experience, especially for students who "just don't get it."
Head First Physics offers a format that's rich in visuals and full of activities, including pictures, illustrations, puzzles, stories, and quizzes -- a mixed-media style proven to stimulate learning and retention. One look will convince you: This isn't mere theory, this is physics brought to life through real-world scenarios, simple experiments, and hypothetical projects. Head First Physics is perfect for anyone who's intrigued by how things work in the natural world.
You'll quickly discover that physics isn't a dry subject. It's all about the world we live in, encompassing everything from falling objects and speeding cars, to conservation of energy and gravity and weightlessness, and orbital behavior. This book:
Helps you think like a physicist so you can understand why things really work the way they do
Gives you relevant examples so you can fully grasp the principles before moving on to more complex concepts
Designed to be used as a supplement study guide for the College Board's Advanced Placement Physics B Exam
Introduces principles for the purpose of solving real-world problems, not memorization
Teaches you how to measure, observe, calculate -- and yes -- how to do the math
Covers scientific notation, SI units, vectors, motion, momentum conservation, Newton's Laws, energy conservation, weight and mass, gravitation and orbits, circular motion and simple harmonic motion, and much more
If "Myth Busters" and other TV programs make you curious about our physical world -- or if you're a student forced to take a physics course -- now you can pursue the subject without the dread of boredom or the fear that it will be over your head. Head First Physics comes to rescue with an innovative, engaging, and inspirational way to learn physics!
2022-01-13 01:26:18
6.59MB
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Multipath Matching Pursuit with Depth-First (MMP-DF) 是一种贪婪算法，它为稀疏重建/近似问题提供近似解：min ||x||_0 使得 Phi * x = y。 该算法来自论文：[*] S. Kwon、J. Wang 和 B. Shim，“多路径匹配追踪”，IEEE Trans。 通知。 理论，卷。 60，没有。 5，第 2986-3001 页，2014 年 5 月。
2022-01-10 12:54:48
3KB
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入门即精通：简单学Java (Head First Java) 中文笔记
2022-01-07 09:04:38
12.91MB
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《Head First Android开发》如果你有一个很好的想法，要开发一流的Android应用，这本书会帮你用最快的速度构建你的第一个实际应用。你会学到一些实践技巧，掌握如何建立应用的结构，如何设计界面，如何创建数据库，如何让你的应用同时适用手机和平板电脑，以及很多其他方面。这就像是有一位富有经验的Android开发人员坐在你旁边！你只需要对Java有一些了解就能轻松地学习这本书。
2022-01-05 12:55:30
92.55MB
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