android usb 外设开发 文件

本设计分享的是国外layout作品资料，恩智浦 iMX6 TinyRex 外设板，专为支持i.MX6 TinyRex模块。该恩智浦 iMX6 TinyRex 外设板支持HDMI视频接收器和SPI闪存（最高128Mbit）等。根据其结构，主要由后面板，前面板，侧面板，底部板等构成。

主要适用于安卓AOA协议开发外设, FT311D开发板功能比较强大, 输出接口包括GPIO, I²C, PWM等, 资源包含芯片适用手册, 安卓开发手册, 用户指南, 安卓demo等.

《Android外设开发实战》这本书的源代码。

iMX6 CORTEX-A9双核四核TinyRex 外设开发底板PDF原理图PCB+AD集成封装库， ALTIUM工程转的PDF原理图PCB文件+AD集成封装库，已在项目中验证，可以做为你的设计参考。集成封装库器件列表：Library Component Count : 106 Name Description ---------------------------------------------------------------------------------------------------- 0022112022 CONN HEADER 2POS .100 VERT GOLD 0467651001 CONN RCPT HDMI MICRO TYPE-D R/A 0471554001 CONN SATA HDR 7POS PCB VERT 0475890001 CONN RCPT MICRO USB AB R/A SMD 1-84952-5 CONN FPC BOTTOM 15POS 1.00MM R/A 2-406549-1 CONN MOD JACK 8POS R/A G-Y PCB 2N7002BKS,115 MOSFET 2N-CH 60V 0.3A 6TSSOP 2N7002BKW,115 MOSFET N-CH 60V 310MA SOT323 3D_iMX6_TINYREX_MODULE_V1I13D Model 47151-0001_v1.1 CONN RCPT 19POS HDMI RT ANG SMD 5787617-1_v1.1 CONN RCPT R/A 4OVER4POS GOLD PCB 68001-202HLF BERGSTIK II .100" SR STRAIGHT 68001-206HLF CONN HEADER 6POS .100 STR 15AU 693071010811 CONN MICRO SD 8 POS SMD ABM3B-28.63636MHZ-10-1-U-TCRYSTAL 28.63636MHZ 10PF SMD ACM2012-900-2P-T002 CHOKE COMM MODE 90 OHM .4A SMD ADV7610BBCZ-P IC RCVR HDMI 165MHZ LP 76-CSBGA BAT54HT1G DIODE SCHOTTKY 30V 0.2A SOD323 BGX50AE6327 DIODE SWITCHING 50V SOT-143 BLM15AX601SN1D FERRITE CHIP 600 OHM 0402 420mA BLM18SG221TN1D FERRITE CHIP 220 OHM 2500MA 0603 C1005C0G1H150J CAP CER 15PF 50V 5% NP0 0402 C1005X5R1A225K CAP CER 2.2UF 10V 10% X5R 0402 C1005X5R1A475M CAP CER 4.7UF 10V 20% X5R 0402 C1005X5R1C105K CAP CER 1.0UF 16V X5R 0402 C1005X5R1H104K CAP CER .10UF 50V X5R 10% 0402 C1005X7R1H221K CAP CER 220PF 50V X7R 10% 0402 C1206X102KGRACTU CAP CER 1000PF 2000V X7R 1206 FT C1608X5R0J106M CAP CER 10UF 6.3V X5R 20% 0603 C1608X5R0J226M080AC CAP CER 22UF 6.3V 20% X5R 0603 C2012X5R1C106M CAP CER 10UF 16V 20% X5R 0805 C2012X5R1C226K CAP CER 22UF 16V 10% X5R 0805 CM2020-00TR IC HDMI TX PORT P/I 38-TSSOP CRCW040210K5FKED RES 10.5K OHM 1/16W 1% 0402 SMD CRCW0402113KFKED

iMX6 CORTEX-A9双核四核TinyRex 外设开发底板ALTIUM设计硬件原理图PCB+AD集成封装库,6层板设计，大小为80x90mm，Altium Designer 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，已制样板测试验证，可作为你产品设计的参考。集成封器件型号列表：Library Component Count : 106 Name Description ---------------------------------------------------------------------------------------------------- 0022112022 CONN HEADER 2POS .100 VERT GOLD 0467651001 CONN RCPT HDMI MICRO TYPE-D R/A 0471554001 CONN SATA HDR 7POS PCB VERT 0475890001 CONN RCPT MICRO USB AB R/A SMD 1-84952-5 CONN FPC BOTTOM 15POS 1.00MM R/A 2-406549-1 CONN MOD JACK 8POS R/A G-Y PCB 2N7002BKS,115 MOSFET 2N-CH 60V 0.3A 6TSSOP 2N7002BKW,115 MOSFET N-CH 60V 310MA SOT323 3D_iMX6_TINYREX_MODULE_V1I13D Model 47151-0001_v1.1 CONN RCPT 19POS HDMI RT ANG SMD 5787617-1_v1.1 CONN RCPT R/A 4OVER4POS GOLD PCB 68001-202HLF BERGSTIK II .100" SR STRAIGHT 68001-206HLF CONN HEADER 6POS .100 STR 15AU 693071010811 CONN MICRO SD 8 POS SMD ABM3B-28.63636MHZ-10-1-U-TCRYSTAL 28.63636MHZ 10PF SMD ACM2012-900-2P-T002 CHOKE COMM MODE 90 OHM .4A SMD ADV7610BBCZ-P IC RCVR HDMI 165MHZ LP 76-CSBGA BAT54HT1G DIODE SCHOTTKY 30V 0.2A SOD323 BGX50AE6327 DIODE SWITCHING 50V SOT-143 BLM15AX601SN1D FERRITE CHIP 600 OHM 0402 420mA BLM18SG221TN1D FERRITE CHIP 220 OHM 2500MA 0603 C1005C0G1H150J CAP CER 15PF 50V 5% NP0 0402 C1005X5R1A225K CAP CER 2.2UF 10V 10% X5R 0402 C1005X5R1A475M CAP CER 4.7UF 10V 20% X5R 0402 C1005X5R1C105K CAP CER 1.0UF 16V X5R 0402 C1005X5R1H104K CAP CER .10UF 50V X5R 10% 0402 C1005X7R1H221K CAP CER 220PF 50V X7R 10% 0402 C1206X102KGRACTU CAP CER 1000PF 2000V X7R 1206 FT C1608X5R0J106M CAP CER 10UF 6.3V X5R 20% 0603 C1608X5R0J226M080AC CAP CER 22UF 6.3V 20% X5R 0603 C2012X5R1C106M CAP CER 10UF 16V 20% X5R 0805 C2012X5R1C226K CAP CER 22UF 16V 10% X5R 0805 CM2020-00TR IC HDMI TX PORT P/I 38-TSSOP CRCW040210K5F

NXP iMX6 CORTEX-A9 TinyRex外设开发底板AD设计硬件原理图+PCB(6层)+封装库+BOM文件，采用6层板设计，板子大小为80x90mm，双面布局布线。主要器件为H5007NL TS3USB221ERSER 28.63636MHz ADV7610BBCZ-P SI4425BDY-T1-E3 MMBT3906,215等。Altium AD设计硬件原理图+PCB工程文件，ad 设计的工程文件，包括原理图及PCB印制板图，可以用Altium Designer(AD)软件打开或修改，可作为你产品设计的参考。

苹果外设开发指南,包括蓝牙,wifi,MFI连接外设等,苹果外设开发必看