Hot Chips 2018两天会议的ppt

[{"title":"（ 27 个子文件 65.89MB ） Hot Chips 2018两天会议的ppt","children":[{"title":"hotchips2018-presentations","children":[{"title":"Day2","children":[{"title":"2.08_NVidia_DLA_Nvidia_DLA_HotChips_10Aug18.pdf <span style='color:#111;'> 883.44KB </span>","children":null,"spread":false},{"title":"2.12_IBM_POWER9_HC30.POWER9Cv6.pdf <span style='color:#111;'> 2.05MB </span>","children":null,"spread":false},{"title":"2.03_Xilinx_Juanjo_XilinxSWPEHotChips20180819.pdf <span style='color:#111;'> 1.89MB </span>","children":null,"spread":false},{"title":"2.11_Xilinx_HC30_Xilinx_Rahul_Nimaiyar_08212018_v2.pdf <span style='color:#111;'> 3.05MB </span>","children":null,"spread":false},{"title":"2.04_Nantero_20180818_hotchips_gervasi_nram_presentation.pdf <span style='color:#111;'> 1.52MB </span>","children":null,"spread":false},{"title":"2.07_ARM_ML_Processor_HC30_ARM_2018_08_17.pdf <span style='color:#111;'> 7.11MB </span>","children":null,"spread":false},{"title":"2.14_NEC_vector_NEC_SXAurora_TSUBASA_HotChips30_finalb.pdf <span style='color:#111;'> 2.14MB </span>","children":null,"spread":false},{"title":"2.13_Fujitsu_HC30.Fujitsu.Yoshida.rev1.2.pdf <span style='color:#111;'> 1.10MB </span>","children":null,"spread":false},{"title":"2.15_Intel_Cascade_Lake_HC30.Intel.Akhilesh.CLXCPU.Final.pdf <span style='color:#111;'> 1.95MB </span>","children":null,"spread":false},{"title":"2.10_DeePhi_HC30_Deephi_SongYao_v6_20180817.pdf <span style='color:#111;'> 3.00MB </span>","children":null,"spread":false},{"title":"2.02_Barefoot_Barefoot_Talk_at_HotChips_2018.pdf <span style='color:#111;'> 329.97KB </span>","children":null,"spread":false},{"title":"2.09_Tachyum_Tachyum_Hotchips_2018.pdf <span style='color:#111;'> 1.05MB </span>","children":null,"spread":false},{"title":"2.05_Mythic_Mythic_Hot_Chips_2018_V5.pdf <span style='color:#111;'> 852.44KB </span>","children":null,"spread":false},{"title":"2.01_Nvidia_NVswitch_HotChips2018_DGX2NVS_Final.pdf <span style='color:#111;'> 1.39MB </span>","children":null,"spread":false}],"spread":false},{"title":"Day1","children":[{"title":"1.04_Intel_Thin_Light_Gaming_HotChips_SC_Final.pdf <span style='color:#111;'> 1.16MB </span>","children":null,"spread":false},{"title":"1.02_Google_HC30.Google.JasonRedgrave.V01.pdf <span style='color:#111;'> 2.23MB </span>","children":null,"spread":false},{"title":"1.07_Hotchips_Security_Keynote.pdf <span style='color:#111;'> 2.63MB </span>","children":null,"spread":false},{"title":"1.12_Nvidia_XavierHotchips2018Final_814.pdf <span style='color:#111;'> 1.21MB </span>","children":null,"spread":false},{"title":"1.01_Samsung_Exynos_HotChips_MK_rev2.pdf <span style='color:#111;'> 2.05MB </span>","children":null,"spread":false},{"title":"1.05_AMD_APU_AMD_Raven_HotChips30_Final.pdf <span style='color:#111;'> 2.13MB </span>","children":null,"spread":false},{"title":"1.03_Berkeley_BROOM_HC30.Berkeley.Celio.v02.pdf <span style='color:#111;'> 11.00MB </span>","children":null,"spread":false},{"title":"1.00a_HC30_Welcome_v3.pdf <span style='color:#111;'> 860.58KB </span>","children":null,"spread":false},{"title":"1.11_MIT_Navion_2018_hotchips_navion_slides_r1.pdf <span style='color:#111;'> 15.59MB </span>","children":null,"spread":false},{"title":"1.00b_HC30_Welcome_TPC.pdf <span style='color:#111;'> 42.90KB </span>","children":null,"spread":false},{"title":"1.13_Microsoft_Hardware_Security_Platform_Behind_Azure_Sphere.pdf <span style='color:#111;'> 735.03KB </span>","children":null,"spread":false},{"title":"1.10_Harvard_Whatmough_Hotchips_2018_0.7.pdf <span style='color:#111;'> 1012.82KB </span>","children":null,"spread":false},{"title":"1.14_Google_Titan_GoogleFinalTitanHotChips2018.pdf <span style='color:#111;'> 4.20MB </span>","children":null,"spread":false}],"spread":false}],"spread":true}],"spread":true}]