JEDEC JESD22系列可靠性测试标准集（包含全部38份最新英文电子版标准文件）.rar

[{"title":"（ 38 个子文件 14.79MB ） JEDEC JESD22系列可靠性测试标准集（包含全部38份最新英文电子版标准文件）.rar","children":[{"title":"JEDEC JESD22-B105E：2018 Lead Integrity - 完整英文电子版（18页）.pdf <span style='color:#111;'> 117.42KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A104F ：2020 Temperature Cycling - 完整英文电子版（15页）.pdf <span style='color:#111;'> 277.33KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A105D ：2020 Power and Temperature Cycling - 完整英文电子版（9页）.pdf <span style='color:#111;'> 167.19KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B113B：2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - 完整英文电子版（24页）.pdf <span style='color:#111;'> 386.72KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B118 ：2011 Semiconductor Wafer and Die Backside External Visual Inspection - 完整英文电子版（15页）.pdf <span style='color:#111;'> 531.16KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B109C：2021 Flip Chip Tensile Pull - 完整英文电子版（13页）.pdf <span style='color:#111;'> 351.81KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A108F-2017 Temperature, Bias, And Operating Life - 完整英文版（10页）.pdf <span style='color:#111;'> 1.67MB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A122A：2016 Power Cycling - 完整英文电子版（16页）.pdf <span style='color:#111;'> 147.40KB </span>","children":null,"spread":false},{"title":"ANSI ESDA JEDEC JS-001-2017 For Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) -Component Level - 完整英文电子版（60页）.pdf <span style='color:#111;'> 1.27MB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B119：2018 Mechanical Compressive Static Stress Test Method - 完整英文电子版（9页）.pdf <span style='color:#111;'> 161.90KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B114B：2020 Mark Legibility - 完整英文电子版（16页）.pdf <span style='color:#111;'> 507.79KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A121A(R2019) Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes - 完整英文电子版（29页）.pdf <span style='color:#111;'> 769.05KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B110B.01：2019 Mechanical Shock – Device and Subassembly - 完整英文电子版（11页）.pdf <span style='color:#111;'> 384.08KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B116B：2017 Wire Bond Shear Test Method - 完整英文电子版（29页）.pdf <span style='color:#111;'> 1.83MB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A120B：2014 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices - 完整英文电子版（13页）.pdf <span style='color:#111;'> 148.85KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B112B ：2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature - 完整英文电子版（27页）.pdf <span style='color:#111;'> 1.48MB </span>","children":null,"spread":false},{"title":"IPC JEDEC J-STD-020E：2014 Moisture Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices - 完整英文电子版（22页）.pdf <span style='color:#111;'> 258.77KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A109B：2011 HERMETICITY - 完整英文电子版（5页）.pdf <span style='color:#111;'> 32.42KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B111A：2016 Board Level Drop Test Method of Components for Handheld Electronic Products - 完整英文电子版（24页）.pdf <span style='color:#111;'> 987.44KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A102E：2015(R2021) Accelerated Moisture Resistance - Unbiased Autoclave - 完整英文电子版（9页）.pdf <span style='color:#111;'> 231.21KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A103E：2015 High Temperature Storage Life（高温储存寿命）- 完整英文版（9页）.pdf <span style='color:#111;'> 478.15KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B101C：2015 External Visual - 完整英文电子版（13页）.pdf <span style='color:#111;'> 57.69KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B100B：2003 Physical Dimensions - 完整英文电子版（5页）.pdf <span style='color:#111;'> 29.22KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A119A：2015 Low Temperature Storage Life - 完整英文电子版（7页）.pdf <span style='color:#111;'> 48.09KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A100E：2020 Cycled Temperature-Humidity-Bias with Surface Condensation Life Test - 完整英文电子版（8页）.pdf <span style='color:#111;'> 177.18KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B117B：2014 Solder Ball Shear - 完整英文电子版（19页）.pdf <span style='color:#111;'> 420.21KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A107C：2013 Salt Atmosphere - 完整英文电子版（5页）.pdf <span style='color:#111;'> 124.04KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B115A.01：2016 Solder Ball Pull - 完整英文电子版（22页）.pdf <span style='color:#111;'> 368.23KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B108B：2010 Coplanarity Test for Surface-Mount Semiconductor Devices - 完整英文电子版（11页）.pdf <span style='color:#111;'> 52.99KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A117E：2018 Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test- 完整英文电子版（21页）.pdf <span style='color:#111;'> 209.08KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B107D：2011 Mark Permanency - 完整英文电子版（11页）.pdf <span style='color:#111;'> 88.17KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A110E：2015 Highly Accelerated Temperature and Humidity Stress Test (HAST) - 完整英文电子版（12页）.pdf <span style='color:#111;'> 122.62KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A101D.01：2021 Steady-State Temperature-Humidity Bias Life Test - 完整英文电子版（10页）.pdf <span style='color:#111;'> 463.21KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A118B.01：2021 Accelerated Moisture Resistance - Unbiased HAST - 完整英文电子版（9页）.pdf <span style='color:#111;'> 198.04KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A106B.01：2016 Thermal Shock - 完整英文电子版（7页）.pdf <span style='color:#111;'> 37.15KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A113I：2020 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing - 完整英文电子版（36页）.pdf <span style='color:#111;'> 1.26MB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-B106E：2016 Resistance to Solder Shock for Through-Hole Mounted Devices - 完整英文电子版（11页）.pdf <span style='color:#111;'> 46.84KB </span>","children":null,"spread":false},{"title":"JEDEC JESD22-A111B ：2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices - 完整英文电子版（19页）.pdf <span style='color:#111;'> 340.14KB </span>","children":null,"spread":false}],"spread":true}]