首页 开发技术 硬件开发 全志H8-VR应用DEMO开发板ALTIUM设计硬件原理图 +PCB(6层)+AD集成封装库文件.zip

全志H8-VR应用DEMO开发板ALTIUM设计硬件原理图 +PCB(6层)+AD集成封装库文件.zip

上传者： GZXGYZ | 上传时间： 2021-03-23 18:10:26 | 文件大小： 2.61MB | 文件类型： ZIP
全志H8-VR应用DEMO开发板ALTIUM设计硬件原理图 +PCB(6层)+AD集成封装库文件，6层板设计，大小为50x75mm，Altium Designer 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，可作为你产品设计的参考。集成封器件型号列表： Library Component Count : 70 Name Description ---------------------------------------------------------------------------------------------------- 1_1.5KE100A 40P_MIPI_0 ?_0 A83_0 AK09911_0 AP3031_0 AP6493_0 AW1660_70_BGA218_1 BMC156_0 BMG160_0 BMG160_1 CAP NP CAP NP_Dup1 RoHS CHIP CAP 10uF +10/-10% X5R CAPACITOR CAPACITOR_0 CAPACITOR_0_Dup1 CAPACITOR_0_Dup2 CAPACITOR_0_Dup3 CAPACITOR_3 CAP_P_1210 CON2_2 CRYSTAL-4_2 Crystal 24MHz 20pF 10ppm -30 to +85 CRYSTAL_XCOL-3 Crystal_0 DIODE BI-DIR TRIG NC/ESD Component,5V,30P,SMD,0402 DIODE SCHOTTKY_0 DIODE_SCHOTTKY D_0 EMMC5_0_BGA169_0 HP_JACK_0 INDUCTOR ROHS CHIP RES 0 Ohm 1/16W +/-5% INDUCTOR_0 INDUCTOR_2 INDUCTOR_Dup1 INDUCTOR_Dup2 INDUCTOR_Dup3 RoHS Power Inductor 22uH 300mA H<1.8MM,CD32 LCM0200CE1A0_2 Camera Conncetor, 24pin,SMT LDO-PT5108/RT9013_0 LED_0 LM1086_2 LM4990_0 Class D Audio AMP LPDDR3_FBGA178_0 NPN R R1 0805 R1 0805_Dup1 R1 0805_Dup2 RES 1B RES 1B_Dup1 ROHS CHIP RES 4.7K 1/16W 5% RESISTOR NC RESISTOR_0 RES,thick film,22Ohm,+/-5%,1/16W,SMD0402 RESISTOR_0_Dup1 RESISTOR_3 RESISTOR_Dup1 ROHS CHIP RES 100K 1/16W +/-5% RESISTOR_Dup2 RT9266PE_0 RT9266PE_2 R_Dup1 R_Dup2 SDMMC SLOT_0 SMALL CAP 贴片电容 SP6646_0 SW_PUSH Sensor_MPU6500_0 TESTPOINT1 TEST T_POINT_R T_POINT_R_0 USB_MINI_SOCKET_5 USB JACK ROHS WPM4005_11 touch_screen_1

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