ARM9 Micro2440核心板altium AD设计硬件原理图和PCB+封装库文件.zip

上传者: GJZGRB | 上传时间: 2021-02-16 20:07:38 | 文件大小: 1.57MB | 文件类型: ZIP
ARM9 Micro2440核心板altium AD设计硬件原理图和PCB+封装库文件,采用6层板设计,板子大小为71x60mm,双面布局布线,主要器件包括CPU S3C2440X BGA289封装,MAX8860EUA18, HY57V561620FTP-H,AM29LV160DB/SST39VF1601E等。Altium Designer 设计的工程文件,包括完整的原理图PCB文件,可以用Altium(AD)软件打开或修改,可作为你产品设计的参考。

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