行业-电子政务-温度控制元件及贴附电子元件到所述温度控制元件的方法.zip
2021-09-02 18:03:30
917KB
电子元件封装术语大全+电子元器件综合知识大全：
电子元件封装术语大全
目录
1、BGA(ball grid array).............................................................................................................3 2、BQFP(quad flat package with bumper)...............................................................................3 3、碰焊 PGA(butt joint pin grid array) 表面贴装型 PGA 的别称(见表面贴装型 PGA)。...3 4、C-(ceramic)..........................................................................................................................3 5、Cerdip..................................................................................................................................3 6、Cerquad...............................................................................................................................4 7、CLCC(ceramic leaded chip carrier) ......................................................................................4 8、COB(chip on board).............................................................................................................4 9、DFP(dual flat package) ........................................................................................................4
10、DIC(dual in-line ceramic package).....................................................................................4
11、DIL(dual in-line).................................................................................................................5
12、DIP(dual in-line package)...................................................................................................5
13、DSO(dual small out-lint)....................................................................................................5
14、DICP(dual tape carrier package)........................................................................................5
15、DIP(dual tape carrier package)..........................................................................................5
16、FP(flat package)...........................................................
2021-09-01 14:09:42
895KB
行业分类-电子政务-PCBA板粘胶电子元件压合力测试机的压力感应座.zip
2021-08-25 22:02:06
195KB