电子元件封装术语大全+电子元器件综合知识大全.zip

电子元件封装术语大全+电子元器件综合知识大全： 电子元件封装术语大全 目录 1、BGA(ball grid array).............................................................................................................3 2、BQFP(quad flat package with bumper)...............................................................................3 3、碰焊 PGA(butt joint pin grid array) 表面贴装型 PGA 的别称(见表面贴装型 PGA)。...3 4、C-(ceramic)..........................................................................................................................3 5、Cerdip..................................................................................................................................3 6、Cerquad...............................................................................................................................4 7、CLCC(ceramic leaded chip carrier) ......................................................................................4 8、COB(chip on board).............................................................................................................4 9、DFP(dual flat package) ........................................................................................................4 10、DIC(dual in-line ceramic package).....................................................................................4 11、DIL(dual in-line).................................................................................................................5 12、DIP(dual in-line package)...................................................................................................5 13、DSO(dual small out-lint)....................................................................................................5 14、DICP(dual tape carrier package)........................................................................................5 15、DIP(dual tape carrier package)..........................................................................................5 16、FP(flat package)...........................................................