Imaging library程序，实现Matrox卡视频采集，抓图等功能

MIL8.0离线开发文件ActiveMILBoardSpecificNotes.chm,ActiveMILGlossary.chm,ActiveMILHelp.chm,ActiveMILUserGuide.chm

美国军方标准，如果可以熟读，那么相信你就可以掌握系统安全最前沿的东西！里面的一些理念非常先进，国内的系统安全的书，可以说都是以其为参考。

最新版本的美军标，代替461F ，试行，未发布，供学习！

基于Thermolib热力学及燃料电池仿真模型 基于MATLAB/Simulink环境 热力学及燃料电池仿真的模型软件。 用于HIL以及MIL开发阶段 低成本、快速搭建燃料电池系统 提供了燃料电池模型仿真所需要的热力学、流体力学电化学React等模型库 提供泵、阀、压缩机、增湿器、冷却系统、罐等外围模型

史上最强mil和mm转换工具。1mm等于多少mil？ 1mil等于多少mm？只需要输入你想要转换的值，自动帮你转换，而且还可以选择转换精度。

几个基于自适应巡航的案例研究，附有MIL测试模型、被测模型、脚本等文件。此处提出的测试框架在MATLAB®/Simulink®/Stateflow®[MathML，MathSL，MathSF]环境中实现，称为嵌入式系统测试模型（MiLEST）。

MIL-HDBK-217F, Notice 1 is issued to correct minor typographical errors in the basic F Revision. MIL HDBK-217F(base document) provides the following changes based upon recently completed studies (see Ret 30 and 32 listed in Appendix C) 1. New failure rate prediction models are provided for the following nine major classes of microcircuits Monolithic Bipolar Digital and Linear Gate/Logic Array Devices Monolithic MOS Digital and Linear Gate/Logic Array Devices Monolithic Bipolar and MOS Digital Microprocessor Devices(Including Controllers Monolithic Bipolar and Mos Memory Devices Monolithic GaAs Digital Devices Monolithic GaAs MMIC Devices Hybrid Microcircuits Magnetic Bubble Memories Surface Acoustic Wave Devices This revision provides new prediction models for bipolar and Mos microcircuits with gate counts up to 60,000, linear microcircuits with up to 3000 transistors, bipolar and Mos digital microprocessor and co- processors up to 32 bits, memory devices with up to 1 million bits, GaAs monolithic microwave integrated circuits(MMICs)with up to 1,000 active elements, and GaAs digital ICs with up to 10,000 transistors. The C, factors have been extensively revised to reflect new technology devices with improved reliability, and the activation energies representing the temperature sensitivity of the dice(IT)have been changed for MOS devices and for memories. The Ca factor remains unchanged from the previous Handbook version, but includes pin grid arrays and surlace mount packages using the same model as hermetic, solder-sealed dual in-line packages. New values have been included for the quality factor (o), the learning factor(i, and the environmental factor(aE). The model for hybrid microcircuits has been revised to be simpler to use, to delete the temperature dependence of the seal and interconnect fallure rate contributions, and to provide a method of calculating chip junction temperatures 2. A new model for Very High Speed Integrated Circuits(VHSIC/HSIC Like)and very

美军标750,主要用于电子行业！对产品的可靠性分析！

MIL-DR 糖尿病视网膜病变数据集的多实例学习