STM32F407单片机+XC6SLX9 FGPA视频采集显示板PDF原理图PCB+AD集成封装库， ALTIUM工程转的PDF原理图PCB文件+AD集成封装库，已在项目中验证，可以做为你的设计参考。集成封装库器件列表： Library Component Count : 37 Name Description ---------------------------------------------------------------------------------------------------- Battery Multicell Battery CAP NP Cap Pol2 Polarized Capacitor (Surface Mount) Circuit Breaker BOOT D Connector 9 Receptacle Assembly, 9 Position, Right Angle DP83848CVV DS3231M FPC_30PIN FPC_40PIN FPC_4PIN HR911105A Header 3 Header, 3-Pin Header 5 Header, 5-Pin Header 5X2 Header, 5-Pin, Dual row Header 6 Header, 6-Pin Inductor Inductor LED2 Typical RED, GREEN, YELLOW, AMBER GaAs LED M25P16 MAX3232ESE 3.0V TO 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceiver Using Four 0.1礔 External Capacitor MAX3490 MINI_SD MINI_USB MT48LC16M16A2P-6A 256Mb Synchronous High-Speed CMOS DRAM, 16Mb x 16Bit x 4 Banks, 54-Pin TSOP Pb-free, Commercial OSC-SMD PS2-6PIN 6 Pin Through Hole PS2 Socket (Kycon P/N) PWR2.5 Low Voltage Power Supply Connector REG1117-3.3 800mA and 1A Low Dropout Positive Regulator 2.85V, 3.3V, 5V, and Adjustable Res2 Resistor S34ML01G200TF100 SMA-KHD STM32F407VGT6 SW-PB Switch TPS7A4501 TSC2046 TVP5151 XC6SLX9-2TQG144I Spartan-6 LX 1.2V FPGA, 102 User I/Os, 144-Pin TQFP (0.5mm Pitch), Speed Grade 2, Industrial Grade, Pb-Free XTAL Crystal Oscillator

STM32L475VGT6物联网开发板ALTIUM设计硬件原理图PCB+AD集成封装库文件，4层板设计，大小为90x62mm，Altium Designer 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，可作为你产品设计的参考。集成封器件型号列表： Library Component Count : 46 Name Description ---------------------------------------------------------------------------------------------------- 1050170001 USB-MICRO-B, 1050170001, SMT, MOLEX 475900001 USB-MICRO-AB, 47590-0001, SMT, MOLEX BAT60JFILM BAT60JFILM BSR14 BSR14 NPN switching transistor SOT23 (Marking U8) CAP_NPOL Capacitor_not polarized EMIF02-USB03F2 2-line IPAD, EMI filter including ESD protection HEADER_2X5 HEADER_2X6_PMOD PMOD Connector Warning Specific Pinout HTS221 Humidity + Temp MEMS Header 10X1_Female_SMDHeader, 10-Pin, SMD, Single row,female Header 2 pins Header 2 pins Header 4 Header, 4-Pin Header 6X1_Female_SMDHeader, 6-Pin, SMD, Single row,female Header 8X1_Female_SMDHeader, 8-Pin, SMD, Single row,female ISM43362-M3G-L44 ISM43362-M3G-L44 Wifi Module 802.11 bgn Inductor Inductor LD1117S33TR LOW DROP FIXED AND ADJUSTABLE POSITIVE VOLTAGE REGULATORS (3.3 Volts) LD1117S50TR IC REG LDO 5V 0.8A SOT223 LD3985M33R Ultra low drop-low noise BiCMOS voltage, regulators low ESR capacitors compatible LD_BICOLOR_CMS Bicolor Led LED Light-Emitting Diode LIS3MDL IC,Sensor LPS22HB IC,Sensor LSM6DSL Accelero + Gyro MEMS (6 Axis) LT1963EST-3.3 LT1963EST-3.3 LDO Low Noise 1.5A fast Transient Response M24SR64-Y M24SR64-Y 64K_EEPROM NFC/RFID MP34DT01 MEMS audio microphone MX25R6435F MX25R6435F Serial Flash Memory 64M PT Point de test RES Resistor SPBTLE-RF SPBTLE-RF SPSGRF SPSGRF-915or SPSGRF-868 ST890CDR 1.2 A current limited high-side power switch with thermal shutdown STM32F103CBT6 Medium-density performance

STM32L475VGT6单片机物联网开发板PDF原理图PCB+AD集成封装库文件, ALTIUM工程转的PDF原理图PCB文件+AD集成封装库，已在项目中验证，可以做为你的设计参考。集成封装库器件列表： Library Component Count : 46 Name Description ---------------------------------------------------------------------------------------------------- 1050170001 USB-MICRO-B, 1050170001, SMT, MOLEX 475900001 USB-MICRO-AB, 47590-0001, SMT, MOLEX BAT60JFILM BAT60JFILM BSR14 BSR14 NPN switching transistor SOT23 (Marking U8) CAP_NPOL Capacitor_not polarized EMIF02-USB03F2 2-line IPAD, EMI filter including ESD protection HEADER_2X5 HEADER_2X6_PMOD PMOD Connector Warning Specific Pinout HTS221 Humidity + Temp MEMS Header 10X1_Female_SMDHeader, 10-Pin, SMD, Single row,female Header 2 pins Header 2 pins Header 4 Header, 4-Pin Header 6X1_Female_SMDHeader, 6-Pin, SMD, Single row,female Header 8X1_Female_SMDHeader, 8-Pin, SMD, Single row,female ISM43362-M3G-L44 ISM43362-M3G-L44 Wifi Module 802.11 bgn Inductor Inductor LD1117S33TR LOW DROP FIXED AND ADJUSTABLE POSITIVE VOLTAGE REGULATORS (3.3 Volts) LD1117S50TR IC REG LDO 5V 0.8A SOT223 LD3985M33R Ultra low drop-low noise BiCMOS voltage, regulators low ESR capacitors compatible LD_BICOLOR_CMS Bicolor Led LED Light-Emitting Diode LIS3MDL IC,Sensor LPS22HB IC,Sensor LSM6DSL Accelero + Gyro MEMS (6 Axis) LT1963EST-3.3 LT1963EST-3.3 LDO Low Noise 1.5A fast Transient Response M24SR64-Y M24SR64-Y 64K_EEPROM NFC/RFID MP34DT01 MEMS audio microphone MX25R6435F MX25R6435F Serial Flash Memory 64M PT Point de test RES Resistor SPBTLE-RF SPBTLE-RF SPSGRF SPSGRF-915or SPSGRF-868 ST890CDR 1.2 A current limited high-side power switch with thermal shutdown STM32F103CBT6 Medium-density performance line ARM-based 32-bit MCU with 128KB Flas

AD9852数字频率合成器开发板ALTIUM硬件原理图PCB+AD集成封装库文件,2层板设计，大小为76x76mm，Altium Designer 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，可作为你产品设计的参考。集成封器件型号列表： Library Component Count : 12 Name Description ---------------------------------------------------------------------------------------------------- AD9852 DDS Cap Capacitor Cap Pol1 Polarized Capacitor (Radial) Header 20X2 Header, 20-Pin, Dual row Inductor Inductor J_POWER J_POWER MC100LVEL16D Differential Receiver Res2 Resistor SMB SMB Straight Connector W KEY 1 to 2 W2 XTALCOSC XTAL

MC9S12DG128最小系统开发板核心板ALTIUM硬件原理图PCB+AD集成封装库,2层板设计，Altium Designer 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，可作为你产品设计的参考。集成封器件型号列表： Library Component Count : 15 Name Description ---------------------------------------------------------------------------------------------------- CAPACITOR POL Capacitor Cap Capacitor Cap Pol1 Polarized Capacitor (Radial) D Connector 9 Receptacle Assembly, 9 Position, Right Angle HEADER 30X2 HEADER 32*2 Header 3 Header, 3-Pin Header 3X2 Header, 3-Pin, Dual row Jumper Jumper Wire LED2 Typical RED, GREEN, YELLOW, AMBER GaAs LED MAX232CPE +5V Powered RS-232 Driver/Receiver MC9S12DG128BMPV 16-Bit Microcontroller Res2 Resistor SW-PB Switch XTAL Crystal Oscillator

VL812主控USB3.0 1拖4端口hub ALTIUM设计硬件原理图PCB+AD集成封装库文件,2层板设计，Altium Designer 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，可作为你产品设计的参考。集成封器件型号列表：Library Component Count : 19 Name Description ---------------------------------------------------------------------------------------------------- APM2301AAC-TR_0 BAT54C/SOT_0 BEAD C CE DCJack-IDJ-D22-6T_0 FUSE G547E2P11U INDUCTOR LED-LT8A23-51-UR96-T5 MX25L512COI-12G R SMD_CRYSTAL_0 SS22_0 TestPoint TitleBlock0 USB-UEA11123-4HK1-4H USB-UEB11123-2JK1-4H_0 VT3470 HUB QFN76_V1_4.02

USB3.0 hub芯片VL812ALTIUM硬件参考设计原理图+PCB+BOM+相关开发技术资料,可以做为你的设计参考。

全志H8-VR应用DEMO开发板ALTIUM设计硬件原理图 +PCB(6层)+AD集成封装库文件，6层板设计，大小为50x75mm，Altium Designer 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，可作为你产品设计的参考。集成封器件型号列表： Library Component Count : 70 Name Description ---------------------------------------------------------------------------------------------------- 1_1.5KE100A 40P_MIPI_0 ?_0 A83_0 AK09911_0 AP3031_0 AP6493_0 AW1660_70_BGA218_1 BMC156_0 BMG160_0 BMG160_1 CAP NP CAP NP_Dup1 RoHS CHIP CAP 10uF +10/-10% X5R CAPACITOR CAPACITOR_0 CAPACITOR_0_Dup1 CAPACITOR_0_Dup2 CAPACITOR_0_Dup3 CAPACITOR_3 CAP_P_1210 CON2_2 CRYSTAL-4_2 Crystal 24MHz 20pF 10ppm -30 to +85 CRYSTAL_XCOL-3 Crystal_0 DIODE BI-DIR TRIG NC/ESD Component,5V,30P,SMD,0402 DIODE SCHOTTKY_0 DIODE_SCHOTTKY D_0 EMMC5_0_BGA169_0 HP_JACK_0 INDUCTOR ROHS CHIP RES 0 Ohm 1/16W +/-5% INDUCTOR_0 INDUCTOR_2 INDUCTOR_Dup1 INDUCTOR_Dup2 INDUCTOR_Dup3 RoHS Power Inductor 22uH 300mA H<1.8MM,CD32 LCM0200CE1A0_2 Camera Conncetor, 24pin,SMT LDO-PT5108/RT9013_0 LED_0 LM1086_2 LM4990_0 Class D Audio AMP LPDDR3_FBGA178_0 NPN R R1 0805 R1 0805_Dup1 R1 0805_Dup2 RES 1B RES 1B_Dup1 ROHS CHIP RES 4.7K 1/16W 5% RESISTOR NC RESISTOR_0 RES,thick film,22Ohm,+/-5%,1/16W,SMD0402 RESISTOR_0_Dup1 RESISTOR_3 RESISTOR_Dup1 ROHS CHIP RES 100K 1/16W +/-5% RESISTOR_Dup2 RT9266PE_0 RT9266PE_2 R_Dup1 R_Dup2 SDMMC SLOT_0 SMALL CAP 贴片电容 SP6646_0 SW_PUSH Sensor_MPU6500_0 TESTPOINT1 TEST T_POINT_R T_POINT_R_0 USB_MINI_SOCKET_5 USB JACK ROHS WPM4005_11 touch_screen_1

全志H8-VR应用DEMO开发板PDF原理图PCB+AD集成封装库文件,集成封器件型号列表：Library Component Count : 70 Name Description ---------------------------------------------------------------------------------------------------- 1_1.5KE100A 40P_MIPI_0 ?_0 A83_0 AK09911_0 AP3031_0 AP6493_0 AW1660_70_BGA218_1 BMC156_0 BMG160_0 BMG160_1 CAP NP CAP NP_Dup1 RoHS CHIP CAP 10uF +10/-10% X5R CAPACITOR CAPACITOR_0 CAPACITOR_0_Dup1 CAPACITOR_0_Dup2 CAPACITOR_0_Dup3 CAPACITOR_3 CAP_P_1210 CON2_2 CRYSTAL-4_2 Crystal 24MHz 20pF 10ppm -30 to +85 CRYSTAL_XCOL-3 Crystal_0 DIODE BI-DIR TRIG NC/ESD Component,5V,30P,SMD,0402 DIODE SCHOTTKY_0 DIODE_SCHOTTKY D_0 EMMC5_0_BGA169_0 HP_JACK_0 INDUCTOR ROHS CHIP RES 0 Ohm 1/16W +/-5% INDUCTOR_0 INDUCTOR_2 INDUCTOR_Dup1 INDUCTOR_Dup2 INDUCTOR_Dup3 RoHS Power Inductor 22uH 300mA H<1.8MM,CD32 LCM0200CE1A0_2 Camera Conncetor, 24pin,SMT LDO-PT5108/RT9013_0 LED_0 LM1086_2 LM4990_0 Class D Audio AMP LPDDR3_FBGA178_0 NPN R R1 0805 R1 0805_Dup1 R1 0805_Dup2 RES 1B RES 1B_Dup1 ROHS CHIP RES 4.7K 1/16W 5% RESISTOR NC RESISTOR_0 RES,thick film,22Ohm,+/-5%,1/16W,SMD0402 RESISTOR_0_Dup1 RESISTOR_3 RESISTOR_Dup1 ROHS CHIP RES 100K 1/16W +/-5% RESISTOR_Dup2 RT9266PE_0 RT9266PE_2 R_Dup1 R_Dup2 SDMMC SLOT_0 SMALL CAP 贴片电容 SP6646_0 SW_PUSH Sensor_MPU6500_0 TESTPOINT1 TEST T_POINT_R T_POINT_R_0 USB_MINI_SOCKET_5 USB JACK ROHS WPM4005_11 PCB封装： 0805 AK09911 AYF333135 BGA156 BGA160 BGA169P0_50B12_00X16_00H1_00 BGA178P0_8X0_65B13X

RT1050EVKB开发板官方CANDENCE ARREGRO原理图PCB+BOM文件