android-support-v17-leanback.jar.zip
2021-05-31 09:05:34
454KB
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android-support-multidex-instrumentation.jar.zip
2021-05-31 09:05:33
1KB
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halcon 2019年7月 18.11版本lisence halcon 2019年7月 18.11版本lisence
2021-05-29 20:20:57
418B
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ST-LINK and STice Support Package.msi安装包，安装之后能完美解决使用IAR开发STMx下载软件到开发板上前提示选择Packager.msi的问题
2021-05-27 09:03:57
10.72MB
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android.support.v7包，支持Theme.AppCompat.Light.NoActionBar， AppCompatActivity
2021-05-25 14:35:28
2.06MB
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Application Note:
[1] Because lack of Address pin A15 in package, following SoCs do not support the 512M*8 DDR3: RK2906-6,RK2906-8,RK3066.
[2]The DRAM Part Number usually consists of two parts divided by '-', which the first part contains memory type, density, orgainization, package, and the second part usually means data rate.
We don't care about the second part.
[3]RockChip platform can support all the chips that match the first part of Part Number which marks '√' or 'T/A', and do not nee d to care the second part. If you want your system running more effective , you may need to find out the exact data rate in DRAM datasheet and config in kernel menuconfig.
[4]Please copy the Rockchip reference design model of DRAM area PCB Layout directly without any modification and follow the PCB layout rules from Rockchip.
Contact information: fae@rock-chips.com [5]Only support for RK3128.
[6]The DRAM's VDD and VDDQ should powered by 1.5V when it used on these SoCs.
2021-05-22 08:37:16
513KB
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