[{"title":"( 4 个子文件 2.68MB ) 全志H6硬件设计资料","children":[{"title":"H6_PRO_DDR3_V1_0-V163.brd <span style='color:#111;'> 8.14MB </span>","children":null,"spread":false},{"title":"H6_PRO_DDR3_V1_0-PCB加工工艺要求说明书.xls <span style='color:#111;'> 232.50KB </span>","children":null,"spread":false},{"title":"H6_PRO_DDR3_V1_0_20170322.DSN <span style='color:#111;'> 1.60MB </span>","children":null,"spread":false},{"title":"H6_PRO_DDR3_V1_0_20170322.pdf <span style='color:#111;'> 604.14KB </span>","children":null,"spread":false}],"spread":true}]