GD32固件开发+固件升级+I2C Bootloader源代码（含上位机源码、含USB转I2C通信板源码）
# I2C BootLoader V0.1 IAP开发流程
须知bootloader和app是两个独立的固件，只是烧写到了FLASH的不同地址处。
- step1: 首先划分好main flash空间, 以本项目为例，将main flash划分成bootloader(addr: 0x08000000 - 0x0800DBFF)和app(addr: 0x0800DC00 - 0x0800FFFF)两部分;
- step2: 准备一份app固件，要求在该app固件中的.ld链接文件中将MEMORY中的FLASH按此处样式修改FLASH (rx) : ORIGIN = 0x0800DC00, LENGTH = 9K， 即ORIGIN修改为step1中app存储起始地址，LENGTH修改为step1中的存储需要的FLASH空间大小, 重新编译固件，生成.bin文件（此处为gd32e23x.bin）;
- step3: 要实现i2c烧写固件，同时需要上位机软件和下位机硬件的支持，本项目中上位机软件为host.py，主要实现Serial串口发送接收读写指令，此处因下位机MCU板支持USB通信，所以此处Serial串口即是实现USB串口收发命令功能。本项目中下位机硬件是一块STM32F103C8T6核心板，USB2I2C文件夹下即是该核心板的驱动源码文件，主要实现USB串口驱动和I2C读写，即可认为此时的STM32F103C8T6核心板是一个USB转I2C设备。
- step4: 要实现i2c批量烧写固件，待烧写设备须提前烧写支持i2c烧写功能的bootloader固件，本项目中BootLoader文件夹下即是bootloader固件工程。即该bootloader支持I2C烧写固件到GD32E232K8Q7待编程设备中，项目中的GD32E23
- step1: 首先划分好main flash空间, 以本项目为例，将main flash划分成bootloader(addr: 0x08000000 - 0x0800DBFF)和app(addr: 0x0800DC00 - 0x0800FFFF)两部分;
- step2: 准备一份app固件，要求在该app固件中的.ld链接文件中将MEMORY中的FLASH按此处样式修改FLASH (rx) : ORIGIN = 0x0800DC00, LENGTH = 9K， 即ORIGIN修改为step1中app存储起始地址，LENGTH修改为step1中的存储需要的FLASH空间大小, 重新编译固件，生成.bin文件（此处为gd32e23x.bin）;
- step3: 要实现i2c烧写固件，同时需要上位机软件和下位机硬件的支持，本项目中上位机软件为host.py，主要实现Serial串口发送接收读写指令，此处因下位机MCU板支持USB通信，所以此处Serial串口即是实现USB串口收发命令功能。本项目中下位机硬件是一块STM32F103C8T6核心板，USB2I2C文件夹下即是该核心板的驱动源码文件，主要实现USB串口驱动和I2C读写，即可认为此时的STM32F103C8T6核心板是一个USB转I2C设备。
- step4: 要实现i2c批量烧写固件，待烧写设备须提前烧写支持i2c烧写功能的bootloader固件，本项目中BootLoader文件夹下即是bootloader固件工程。即该bootloader支持I2C烧写固件到GD32E232K8Q7待编程设备中，项目中的GD32E23
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本站所有资源不代表本站的观点或立场，基于网友分享，根据中国法律《信息网络传播权保护条例》第二十二条之规定，若资源存在侵权或相关问题请联系本站客服人员，zhiweidada#qq.com，请把#换成@，本站将给予最大的支持与配合，做到及时反馈和处理。关于更多版权及免责申明参见 版权及免责申明