硅集成电路工艺基础 关旭东

[{"title":"（ 24 个子文件 22.93MB ） 硅集成电路工艺基础 关旭东","children":[{"title":"s（硅工艺）","children":[{"title":"课件","children":[{"title":"（s）第二章 氧化（part2）.ppt <span style='color:#111;'> 526.50KB </span>","children":null,"spread":false},{"title":"（s）第六章 化学气相淀积.ppt <span style='color:#111;'> 3.35MB </span>","children":null,"spread":false},{"title":"~$（s）第八章 光刻与刻蚀工艺.ppt <span style='color:#111;'> 165B </span>","children":null,"spread":false},{"title":"（s）第四章 离子注入.ppt <span style='color:#111;'> 2.77MB </span>","children":null,"spread":false},{"title":"作业","children":[{"title":"第二章 氧化-作业.ppt <span style='color:#111;'> 82.00KB </span>","children":null,"spread":false},{"title":"~$余误差函数表.ppt <span style='color:#111;'> 165B </span>","children":null,"spread":false},{"title":"第六七章 CVD和外延（作业）.ppt <span style='color:#111;'> 45.50KB </span>","children":null,"spread":false},{"title":"第四章 离子注入(作业).ppt <span style='color:#111;'> 36.00KB </span>","children":null,"spread":false},{"title":"余误差函数表.ppt <span style='color:#111;'> 53.00KB </span>","children":null,"spread":false},{"title":"第九章 金属化与多层互连(作业).ppt <span style='color:#111;'> 39.50KB </span>","children":null,"spread":false},{"title":"第八章 光刻与刻蚀工艺(作业).ppt <span style='color:#111;'> 45.50KB </span>","children":null,"spread":false},{"title":"~$第四章 离子注入(作业).ppt <span style='color:#111;'> 165B </span>","children":null,"spread":false},{"title":"第三章 扩散(作业).ppt <span style='color:#111;'> 62.00KB </span>","children":null,"spread":false}],"spread":true},{"title":"（s）第三章 扩散（part1）.ppt <span style='color:#111;'> 1.21MB </span>","children":null,"spread":false},{"title":"已讲","children":null,"spread":false},{"title":"（s）第九章 金属化与多层互连.ppt <span style='color:#111;'> 2.49MB </span>","children":null,"spread":false},{"title":"（s）第五章 物理气相淀积.ppt <span style='color:#111;'> 1.22MB </span>","children":null,"spread":false},{"title":"（s）第二章 氧化（part3）.ppt <span style='color:#111;'> 1.49MB </span>","children":null,"spread":false},{"title":"（s）第二章 氧化(part1).ppt <span style='color:#111;'> 1.01MB </span>","children":null,"spread":false},{"title":"（s）第八章 光刻与刻蚀工艺.ppt <span style='color:#111;'> 4.46MB </span>","children":null,"spread":false},{"title":"（s）第三章 扩散（part2）.ppt <span style='color:#111;'> 919.50KB </span>","children":null,"spread":false},{"title":"（s）第七章 外延.ppt <span style='color:#111;'> 3.24MB </span>","children":null,"spread":false},{"title":"（s）第一章 衬底制备.ppt <span style='color:#111;'> 10.05MB </span>","children":null,"spread":false},{"title":"~$（s）第三章 扩散（part1）.ppt <span style='color:#111;'> 165B </span>","children":null,"spread":false}],"spread":false},{"title":"余误差.ppt <span style='color:#111;'> 75.00KB </span>","children":null,"spread":false}],"spread":true}],"spread":true}]