高速先生 一搏研讨会课件，高速数字电路设计方面必看的经典课件

[{"title":"（ 29 个子文件 175.07MB ） 高速先生 一搏研讨会课件，高速数字电路设计方面必看的经典课件","children":[{"title":"一博历届研讨会课件","children":[{"title":"高频应用的覆铜板材料 - 趋势、选择与电性.pdf <span style='color:#111;'> 4.99MB </span>","children":null,"spread":false},{"title":"串行总线的自我介绍.pdf <span style='color:#111;'> 3.11MB </span>","children":null,"spread":false},{"title":"PCB PCBA Continuous Improvements.pdf <span style='color:#111;'> 1.03MB </span>","children":null,"spread":false},{"title":"DFXDFM设计规范在产品中应用及案例解析.pdf <span style='color:#111;'> 9.63MB </span>","children":null,"spread":false},{"title":"可靠性之高速设计.pdf <span style='color:#111;'> 2.28MB </span>","children":null,"spread":false},{"title":"高速串行总线的设计和仿真.pdf <span style='color:#111;'> 3.29MB </span>","children":null,"spread":false},{"title":"高速串行总线无源通道建模及校准.pdf <span style='color:#111;'> 1.94MB </span>","children":null,"spread":false},{"title":"PCB设计十大误区（上）.pdf <span style='color:#111;'> 4.68MB </span>","children":null,"spread":false},{"title":"DDR3&4设计与仿真详解.pdf <span style='color:#111;'> 8.04MB </span>","children":null,"spread":false},{"title":"串扰从入门到进阶.pdf <span style='color:#111;'> 4.15MB </span>","children":null,"spread":false},{"title":"5G时代下的无源通道建模及仿真测试校准.pdf <span style='color:#111;'> 3.24MB </span>","children":null,"spread":false},{"title":"DDR3&DDR4设计与仿真.pdf <span style='color:#111;'> 3.85MB </span>","children":null,"spread":false},{"title":"BGA贴片技术详解.pdf <span style='color:#111;'> 6.29MB </span>","children":null,"spread":false},{"title":"迎接高速时代的挑战.pdf <span style='color:#111;'> 6.92MB </span>","children":null,"spread":false},{"title":"高速PCB设计验证的那些事.pdf <span style='color:#111;'> 3.06MB </span>","children":null,"spread":false},{"title":"10GBASE-KR 介绍及仿真优化.pdf <span style='color:#111;'> 3.78MB </span>","children":null,"spread":false},{"title":"细节决定成败-PCB设计中需要注意的问题.pdf <span style='color:#111;'> 12.73MB </span>","children":null,"spread":false},{"title":"PCB制造的可靠性设计及DFM案例分析.pdf <span style='color:#111;'> 15.02MB </span>","children":null,"spread":false},{"title":"PCB设计十大误区（中）.pdf <span style='color:#111;'> 5.34MB </span>","children":null,"spread":false},{"title":"小型化设计的实现与应用.pdf <span style='color:#111;'> 2.91MB </span>","children":null,"spread":false},{"title":"PCB设计十大误区.pdf <span style='color:#111;'> 7.53MB </span>","children":null,"spread":false},{"title":"高性能“互连”技术研讨会.pdf <span style='color:#111;'> 5.02MB </span>","children":null,"spread":false},{"title":"电子产品高可靠性设计、仿真与调试.pdf <span style='color:#111;'> 23.83MB </span>","children":null,"spread":false},{"title":"高可靠性电子装联技术案例分析.pdf <span style='color:#111;'> 7.63MB </span>","children":null,"spread":false},{"title":"高性能电路设计与产品可靠性.pdf <span style='color:#111;'> 4.41MB </span>","children":null,"spread":false},{"title":"如何选择高速板材.pdf <span style='color:#111;'> 4.83MB </span>","children":null,"spread":false},{"title":"建立新的高速总线设计规则.pdf <span style='color:#111;'> 6.73MB </span>","children":null,"spread":false},{"title":"高速电路仿真测试联合分析方法.pdf <span style='color:#111;'> 5.76MB </span>","children":null,"spread":false},{"title":"PCB的前世今生.pdf <span style='color:#111;'> 7.49MB </span>","children":null,"spread":false}],"spread":false}],"spread":true}]