3D Integration for NoC-based SoC Architectures

3D integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as truly hot and broad research topics. As the end of scaling the CMOS transistor comes in sight, the third dimension may come to the rescue of the industry to allow for a continuing exponential growth of integration during the 2015–2025 period. As such 3D stacking may be the key technology to sustain growth until more exotic technologies such as nanowires, quantum dot devices and molecular computers become sufficiently mature for deployment in main stream application areas. The present book gathers the recent advances in the domain written by renowned experts to build a comprehensive and consistent book around the topics of threedimensional architectures and design techniques.