Printed Circuits Handbook

印刷电路板手册第六版 Part 1 Lead-Free Legislation Chapter 1. Legislation and Impact on Printed Circuits 1.3 1.1 Legislation Overview / 1.3 1.2 Waste Electrical and Electronic Equipment (WEEE) / 1.3 1.3 Restriction of Hazardous Substances (RoHS) / 1.3 1.4 RoHS’ Impact on the Printed Circuit Industry / 1.6 1.5 Lead-Free perspecives / 1.10 1.6 Other Legislative Initiatives / 1.10 Part 2 Printed Circuit Technology Drivers Chapter 2. ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY 2.3 2.1 Introduction / 2.3 2.2 Measuring the Interconnectivity Revolution (HDI) / 2.3 2.3 Hierarchy of Interconnections / 2.6 2.4 Factors Affecting Selection of Interconnections / 2.7 2.5 ICS and Packages / 2.10 2.6 Density Evaluations / 2.14 2.7 Methods to Increase PWB Density / 2.16 References / 2.21 Chapter 3. Semiconductor Packaging Technology 3.1 3.1 Introduction / 3.1 3.2 Single-Chip Packaging / 3.5 3.3 Multichip Packages / 3.15 3.4 Optical Interconnects / 3.18 3.5 High-Density/High-Performance Packaging Summary / 3.21 3.6 Roadmap Information / 3.21 References / 3.21 Chapter 4. Advanced Component Packaging 4.1 4.1 Introduction / 4.1 4.2 Lead-Free / 4.2 4.3 System-on-a-Chip (SOC) versus System-on-a-Package (SOP) / 4.3 v For more information about this title, click here 4.4 Multichip Modules / 4.5 4.5 Multichip Packaging / 4.6 4.6 Enabling Technologies / 4.10 4.7 Acknowledgment / 4.18 References / 4.18 Chapter 5. Types of Printed Wiring Boards 5.1 5.1 Introduction / 5.1 5.2 Classification of Printed Wiring Boards / 5.1 5.3 Organic and Nonorganic Substrates / 5.3 5.4 Graphical and Discrete-Wire Boards / 5.3 5.5 Rigid and Flexible Boards / 5.5 5.6 Graphically Produced Boards / 5.6 5.7 Molded Interconnection Devices / 5.10 5.8 Plated-Through-Hole (PTH) Technologies / 5.10 5.9 Summary / 5.13 References / 5.14 Part 3 Materials Chapter 6. Introduction to Base Materials 6.3 6.1 Introduction / 6.1 6.2 Grades and Specifications / 6.3 6.3 Properties Used to Classify Base Materials / 6.9 6.4 Types of F