芯片制造技术-芯片制造类技术资料合集.zip

[{"title":"（ 26 个子文件 103.17MB ） 芯片制造技术-芯片制造类技术资料合集.zip","children":[{"title":"芯片制造","children":[{"title":"倒装芯片凸点制作方法.pdf <span style='color:#111;'> 257.76KB </span>","children":null,"spread":false},{"title":"芯片微纳制造技术.pptx <span style='color:#111;'> 6.19MB </span>","children":null,"spread":false},{"title":"第四章-芯片制造概述.ppt <span style='color:#111;'> 2.44MB </span>","children":null,"spread":false},{"title":"图解芯片制作工艺流程.pdf <span style='color:#111;'> 1.29MB </span>","children":null,"spread":false},{"title":"柔性电子制造技术基础-第4讲-PART1-2014.pdf <span style='color:#111;'> 3.39MB </span>","children":null,"spread":false},{"title":"第三章-集成电路的制造工艺.ppt <span style='color:#111;'> 3.33MB </span>","children":null,"spread":false},{"title":"集成电路制造工艺课件.ppt <span style='color:#111;'> 9.97MB </span>","children":null,"spread":false},{"title":"芯片制造工艺流程简介.ppt <span style='color:#111;'> 4.05MB </span>","children":null,"spread":false},{"title":"21-系统芯片与片上通信结构.pptx <span style='color:#111;'> 15.18MB </span>","children":null,"spread":false},{"title":"第四章-集成电路制造工艺.ppt <span style='color:#111;'> 9.52MB </span>","children":null,"spread":false},{"title":"集成电路制造工艺之光刻与刻蚀工艺.ppt <span style='color:#111;'> 1.67MB </span>","children":null,"spread":false},{"title":"第4章---14芯片制造概述.doc <span style='color:#111;'> 16.17MB </span>","children":null,"spread":false},{"title":"CH3-硅片加工倒角.ppt <span style='color:#111;'> 2.35MB </span>","children":null,"spread":false},{"title":"集成电路设计常识-山大暑期学校-集成电路.ppt <span style='color:#111;'> 8.47MB </span>","children":null,"spread":false},{"title":"芯片制作工艺流程.doc <span style='color:#111;'> 56.00KB </span>","children":null,"spread":false},{"title":"芯片生产工艺流程.doc <span style='color:#111;'> 28.50KB </span>","children":null,"spread":false},{"title":"芯片的制造过程.doc <span style='color:#111;'> 95.50KB </span>","children":null,"spread":false},{"title":"芯片制程(以-Intel-芯片为例).docx <span style='color:#111;'> 571.60KB </span>","children":null,"spread":false},{"title":"芯片制造技术.ppt <span style='color:#111;'> 1.18MB </span>","children":null,"spread":false},{"title":"6.3-集成电路制造工艺技术.ppt <span style='color:#111;'> 11.28MB </span>","children":null,"spread":false},{"title":"芯片制造工艺.ppt <span style='color:#111;'> 817.00KB </span>","children":null,"spread":false},{"title":"芯片制造倒装焊工艺与设备解决方案.pdf <span style='color:#111;'> 452.61KB </span>","children":null,"spread":false},{"title":"MEMS工艺(3半导体工艺)扬卫.ppt <span style='color:#111;'> 4.89MB </span>","children":null,"spread":false},{"title":"段辉高-2-半导体中的材料、硅片制作流程.pptx <span style='color:#111;'> 4.46MB </span>","children":null,"spread":false},{"title":"半导体芯片制造技术5.ppt <span style='color:#111;'> 1.11MB </span>","children":null,"spread":false},{"title":"第十一章-半导体材料制备.ppt <span style='color:#111;'> 2.59MB </span>","children":null,"spread":false}],"spread":false}],"spread":true}]