[{"title":"( 38 个子文件 90.89MB ) 芯片制造技术-芯片设计类技术资料合集.zip","children":[{"title":"芯片设计","children":[{"title":"模拟芯片设计的四个层次.doc <span style='color:#111;'> 35.00KB </span>","children":null,"spread":false},{"title":"集成电路技术简介.pptx <span style='color:#111;'> 22.46MB </span>","children":null,"spread":false},{"title":"5--芯片规划与设计(3学时).ppt <span style='color:#111;'> 2.52MB </span>","children":null,"spread":false},{"title":"集成电路-ch1.ppt <span style='color:#111;'> 3.53MB </span>","children":null,"spread":false},{"title":"系统芯片SOC设计.ppt <span style='color:#111;'> 205.00KB </span>","children":null,"spread":false},{"title":"超大规模集成电路中低功耗设计与分析.pdf <span style='color:#111;'> 760.57KB </span>","children":null,"spread":false},{"title":"基于DSP芯片设计的一种波形发生器.doc <span style='color:#111;'> 23.50KB </span>","children":null,"spread":false},{"title":"一种基于MEMS技术的压力传感器芯片设计-王大军.pdf <span style='color:#111;'> 955.32KB </span>","children":null,"spread":false},{"title":"半导体缺陷解析及中英文术语一览.pdf <span style='color:#111;'> 173.58KB </span>","children":null,"spread":false},{"title":"用555芯片设计的施密特触发器电路1.doc <span style='color:#111;'> 84.50KB </span>","children":null,"spread":false},{"title":"超大规模集成电路设计.ppt <span style='color:#111;'> 9.17MB </span>","children":null,"spread":false},{"title":"ic设计流程工具.docx <span style='color:#111;'> 19.02KB </span>","children":null,"spread":false},{"title":"常用存储器芯片设计指南.pdf <span style='color:#111;'> 199.03KB </span>","children":null,"spread":false},{"title":"ASIC芯片设计生产流程.ppt <span style='color:#111;'> 2.46MB </span>","children":null,"spread":false},{"title":"同步升压芯片设计指南.ppt <span style='color:#111;'> 1.41MB </span>","children":null,"spread":false},{"title":"射频芯片校准设计.pdf <span style='color:#111;'> 1.16MB </span>","children":null,"spread":false},{"title":"LDO芯片设计报告及电路分析报告.pdf <span style='color:#111;'> 1.24MB </span>","children":null,"spread":false},{"title":"晶圆及芯片测试.doc <span style='color:#111;'> 471.00KB </span>","children":null,"spread":false},{"title":"华大半导体181页PPT基础知识培训——常用半导体器件讲解.ppt <span style='color:#111;'> 2.61MB </span>","children":null,"spread":false},{"title":"芯片研发过程介绍.pdf <span style='color:#111;'> 342.53KB </span>","children":null,"spread":false},{"title":"芯片设计过程.doc <span style='color:#111;'> 32.50KB </span>","children":null,"spread":false},{"title":"影响倒角加工效率的工艺研究-康洪亮.doc <span style='color:#111;'> 1.13MB </span>","children":null,"spread":false},{"title":"半导体制程简介.ppt <span style='color:#111;'> 1.03MB </span>","children":null,"spread":false},{"title":"集成电路设计的现状与未来.ppt <span style='color:#111;'> 1.34MB </span>","children":null,"spread":false},{"title":"集成电路版图设计5.ppt <span style='color:#111;'> 8.53MB </span>","children":null,"spread":false},{"title":"ECO技术在SoC芯片设计中的应用-王巍.pdf <span style='color:#111;'> 364.88KB </span>","children":null,"spread":false},{"title":"18微米芯片后端设计的相关技术.pdf <span style='color:#111;'> 406.38KB </span>","children":null,"spread":false},{"title":"关于芯片和芯片设计的科普——集成电路设计人员给家人的科普.ppt <span style='color:#111;'> 11.66MB </span>","children":null,"spread":false},{"title":"第二讲.集成电路芯片的发展历史设计与制造.ppt <span style='color:#111;'> 2.84MB </span>","children":null,"spread":false},{"title":"集成电路芯片设计.ppt <span style='color:#111;'> 13.55MB </span>","children":null,"spread":false},{"title":"集成电路EDA设计概述.ppt <span style='color:#111;'> 3.72MB </span>","children":null,"spread":false},{"title":"图形芯片设计全过程.doc <span style='color:#111;'> 423.00KB </span>","children":null,"spread":false},{"title":"集成电路(IC)设计完整流程详解及各个阶段工具简介.docx <span style='color:#111;'> 20.32KB </span>","children":null,"spread":false},{"title":"芯片设计流程.pdf <span style='color:#111;'> 96.40KB </span>","children":null,"spread":false},{"title":"芯片设计和生产流程.pdf <span style='color:#111;'> 983.11KB </span>","children":null,"spread":false},{"title":"数字IC芯片设计.ppt <span style='color:#111;'> 1.54MB </span>","children":null,"spread":false},{"title":"芯片设计实现介绍.pptx <span style='color:#111;'> 3.72MB </span>","children":null,"spread":false},{"title":"深入大规模芯片设计全过程.doc <span style='color:#111;'> 35.00KB </span>","children":null,"spread":false}],"spread":false}],"spread":true}]