STM32F429_F767_H743核心板+底板封装库（AD PADS CADENCE三种规格原理图PCB封装库）.zip

STM32F429_F767_H743核心板+底板封装库（AD PADS CADENCE三种规格原理图PCB封装库） Library Component Count : 126 Name Description ---------------------------------------------------------------------------------------------------- 1086-3.3 12MHZ_1 12MHZ_1_1 2X15P_2.0MM_DIP 2X4_1 6PIN-2_0.0-D-H 74LVC1G125 AP3216C_0 AP6181 B2BF_2X40_0 B2B_2X40_0_1 B2S_1 BEAD IND FER BEAD 330OHM@100MHZ 1.7A 0603 BEAD_1 C0603_0 C0603_0_1 C0603_0_2 C0603_0_3 C0603_0_4 C1608 C1608_1 C1608_2 CONN_HDR_2X1 HDR 1X2 TH 100MIL SP 339H AU 98L CONN_HDR_6X1 CON 1X6 SKT TH 100MIL SP 344H AU 118L CONN_HDR_7 HDR 1X2 TH 100MIL SP 339H AU 98L CON_8_SDCARD_DETECT_1CON 8 SKT SD/MMC PUSH-PUSH RA SMT 1.1MM SP 83H AU CON_DB9 CR1220 CRYSTAL_JXS63 XTAL 24MHZ -- 30PPM 3.2X2.5MM SMD CRYSTAL_JXS63_1 XTAL 24MHZ -- 30PPM 3.2X2.5MM SMD CT2012_0 CT2012_0_1 CT2012_0_2 DHT11_DS18B20 DHT11_DS18B20_1 DIODE DIODE_BI-DIR_TRIG DIP-2X10-2P54 DIP_2X40_2P54 DLR1150_3 FE1.1S FUSE HDR_1X3_TH JTAG_20PIN LAN8720A LED_0 LED GRN SGL 25MA 0603 LED_1 LED GRN SGL 25MA 0603 LQH32C_0 LQH32C_0_1 MAX3232EEAE MAX3232EEAE_1 MIC_JACK MIC_JACK_1 MIC_POM AUDIO DEVICE MIC 0.5MA 2V 38-48+/-3dB 2.2KOHM 6MM TH MOSFET_P TRAN PMOS PWR 12V 4.3A SOT23 MP2482DN_2 MPU-6050_1 MS90C385_1 NPN TRAN NPN GEN 0.5A 45V AEC-Q101 SOT23 PIEZO_BUZZER_0 POWER_JACK_3 RJ45_HR961160C_0 CON 12 RJ45 SHLD RA SM 1.02MM SP 625H -- SIP5_2_1 SPACER_0 FASTENER, STANDOFF 4.5