单片机课程设计（数字温度控制器）

[{"title":"（ 17 个子文件 292KB ） 单片机课程设计（数字温度控制器）","children":[{"title":"单片机课程设计","children":[{"title":"单片机课程设计","children":[{"title":"温度控制器1.doc <span style='color:#111;'> 1.88MB </span>","children":null,"spread":false},{"title":"硬件仿真和keil","children":[{"title":"18b20.PWI <span style='color:#111;'> 1.03KB </span>","children":null,"spread":false},{"title":"aaa.M51 <span style='color:#111;'> 18.03KB </span>","children":null,"spread":false},{"title":"1820.c <span style='color:#111;'> 5.59KB </span>","children":null,"spread":false},{"title":"aaa_Uv2.Bak <span style='color:#111;'> 2.04KB </span>","children":null,"spread":false},{"title":"18b20 <span style='color:#111;'> 0B </span>","children":null,"spread":false},{"title":"aaa_Opt.Bak <span style='color:#111;'> 1.08KB </span>","children":null,"spread":false},{"title":"1820.OBJ <span style='color:#111;'> 15.20KB </span>","children":null,"spread":false},{"title":"aaa.plg <span style='color:#111;'> 214B </span>","children":null,"spread":false},{"title":"aaa.hex <span style='color:#111;'> 5.70KB </span>","children":null,"spread":false},{"title":"aaa.Opt <span style='color:#111;'> 1.09KB </span>","children":null,"spread":false},{"title":"1820.LST <span style='color:#111;'> 11.29KB </span>","children":null,"spread":false},{"title":"aaa.Uv2 <span style='color:#111;'> 2.08KB </span>","children":null,"spread":false},{"title":"Last Loaded 18b20.DBK <span style='color:#111;'> 95.24KB </span>","children":null,"spread":false},{"title":"aaa <span style='color:#111;'> 13.70KB </span>","children":null,"spread":false},{"title":"aaa.lnp <span style='color:#111;'> 24B </span>","children":null,"spread":false},{"title":"18b20.DSN <span style='color:#111;'> 97.82KB </span>","children":null,"spread":false}],"spread":false}],"spread":true}],"spread":true}],"spread":true}]