《芯片SIP封装与工程设计》章节例子20201017.rar

[{"title":"（ 51 个子文件 6.27MB ） 《芯片SIP封装与工程设计》章节例子20201017.rar","children":[{"title":"第4章","children":[{"title":"bga_pad.pad <span style='color:#111;'> 2.77KB </span>","children":null,"spread":false},{"title":"wb_tackpoint.pad <span style='color:#111;'> 2.78KB </span>","children":null,"spread":false},{"title":"codesign_bga.psm <span style='color:#111;'> 51.91KB </span>","children":null,"spread":false},{"title":"via_wbu.pad <span style='color:#111;'> 2.77KB </span>","children":null,"spread":false},{"title":"pbar_power.pad <span style='color:#111;'> 2.63KB </span>","children":null,"spread":false},{"title":"die.psm <span style='color:#111;'> 49.75KB </span>","children":null,"spread":false},{"title":"DIE_data.txt <span style='color:#111;'> 9.40KB </span>","children":null,"spread":false},{"title":"BGA1_data.txt <span style='color:#111;'> 10.14KB </span>","children":null,"spread":false},{"title":"pbar_gnd.pad <span style='color:#111;'> 2.63KB </span>","children":null,"spread":false},{"title":"via1-4.pad <span style='color:#111;'> 2.91KB </span>","children":null,"spread":false},{"title":"bf1.pad <span style='color:#111;'> 2.77KB </span>","children":null,"spread":false},{"title":"pbar_top_cond.pad <span style='color:#111;'> 2.78KB </span>","children":null,"spread":false},{"title":"pbar_bot_cond.pad <span style='color:#111;'> 2.78KB </span>","children":null,"spread":false},{"title":"via.pad <span style='color:#111;'> 2.91KB </span>","children":null,"spread":false},{"title":"pbar_l2.pad <span style='color:#111;'> 2.63KB </span>","children":null,"spread":false},{"title":"bga127_pad.pad <span style='color:#111;'> 2.78KB </span>","children":null,"spread":false},{"title":"codesign_bga.dra <span style='color:#111;'> 84.45KB </span>","children":null,"spread":false},{"title":"codesign_bga.txt <span style='color:#111;'> 2.94KB </span>","children":null,"spread":false},{"title":"Proj1_16_routed1_cm.spd <span style='color:#111;'> 908.17KB </span>","children":null,"spread":false},{"title":"pbar_l3.pad <span style='color:#111;'> 2.63KB </span>","children":null,"spread":false},{"title":"die.dra <span style='color:#111;'> 83.56KB </span>","children":null,"spread":false},{"title":"die_pad.pad <span style='color:#111;'> 2.77KB </span>","children":null,"spread":false},{"title":"codesign_bga__1.txt <span style='color:#111;'> 2.98KB </span>","children":null,"spread":false},{"title":"die.txt <span style='color:#111;'> 3.26KB </span>","children":null,"spread":false}],"spread":false},{"title":"第7章","children":[{"title":"Proj1_16_routed1_cm.ximx <span style='color:#111;'> 22.43KB </span>","children":null,"spread":false},{"title":"Proj1_16_routed1_cm.spd <span style='color:#111;'> 908.17KB </span>","children":null,"spread":false}],"spread":true},{"title":"第8章","children":[{"title":"Pin_Net_Mix_Comparison_V1.rar <span style='color:#111;'> 2.92MB </span>","children":null,"spread":false},{"title":"BGA_PINMAP_COLORED_V1.rar <span style='color:#111;'> 3.02MB </span>","children":null,"spread":false}],"spread":true},{"title":"第5章","children":[{"title":"fc_route.tcf <span style='color:#111;'> 234.86KB </span>","children":null,"spread":false},{"title":"c0402.dra <span style='color:#111;'> 59.24KB </span>","children":null,"spread":false},{"title":"codesign_bga.psm <span style='color:#111;'> 52.71KB </span>","children":null,"spread":false},{"title":"obl15x28.pad <span style='color:#111;'> 2.99KB </span>","children":null,"spread":false},{"title":"BGA1_data.txt <span style='color:#111;'> 9.75KB </span>","children":null,"spread":false},{"title":"via4-5.pad <span style='color:#111;'> 3.14KB </span>","children":null,"spread":false},{"title":"dump_libraries.log <span style='color:#111;'> 1.39KB </span>","children":null,"spread":false},{"title":"via2-3.pad <span style='color:#111;'> 3.14KB </span>","children":null,"spread":false},{"title":"via3-4.pad <span style='color:#111;'> 3.14KB </span>","children":null,"spread":false},{"title":"flip_chip_240.txt <span style='color:#111;'> 11.31KB </span>","children":null,"spread":false},{"title":"bumpc4.pad <span style='color:#111;'> 2.99KB </span>","children":null,"spread":false},{"title":"flip_chip_240.psm <span style='color:#111;'> 69.09KB </span>","children":null,"spread":false},{"title":"flip_chip_240.dra <span style='color:#111;'> 95.51KB </span>","children":null,"spread":false},{"title":"via1-6.pad <span style='color:#111;'> 3.70KB </span>","children":null,"spread":false},{"title":"via1-2.pad <span style='color:#111;'> 3.14KB </span>","children":null,"spread":false},{"title":"c0402.psm <span style='color:#111;'> 8.82KB </span>","children":null,"spread":false},{"title":"via5-6.pad <span style='color:#111;'> 3.14KB </span>","children":null,"spread":false},{"title":"D1_data.txt <span style='color:#111;'> 13.15KB </span>","children":null,"spread":false},{"title":"bga127_pad.pad <span style='color:#111;'> 3.00KB 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