[{"title":"( 8 个子文件 98.32MB ) IEC 62258-1~8 Semiconductor die products(半导体芯片产品) - 包含8份最新英文版标准文件 .rar","children":[{"title":"IEC 62258-1:2009 Semiconductor die products - Part 1:Procurement and use - 完整英文版(92页).pdf <span style='color:#111;'> 69.04MB </span>","children":null,"spread":false},{"title":"IEC TR 62258-7:2007 Semiconductor die products - Part 7:XML schema for data exchange - 完整英文版(28页).pdf <span style='color:#111;'> 357.33KB </span>","children":null,"spread":false},{"title":"IEC TR 62258-4:2012 Semiconductor die products – Part 4:Questionnaire for die users and suppliers - 完整英文电子版(39页).pdf <span style='color:#111;'> 984.03KB </span>","children":null,"spread":false},{"title":"IEC TR 62258-3:2005 Semiconductor die products - Part 3:Recommendations for good practice in handling, packing and storage - 完整英文版(47页).pdf <span style='color:#111;'> 1.69MB </span>","children":null,"spread":false},{"title":"IEC 62258-2:2011 Semiconductor die products - Part 2:Exchange data formats -完整英文版(143页).pdf <span style='color:#111;'> 39.87MB </span>","children":null,"spread":false},{"title":"IEC 62258-5:2006 Semiconductor die products - Part 5:Requirements for information concerning electrical simulation - 完整英文版(15页).pdf <span style='color:#111;'> 391.09KB </span>","children":null,"spread":false},{"title":"IEC 62258-6:2006 Semiconductor die products - Part 6:Requirements for information concerning thermal simulation - 完整英文版(12页).pdf <span style='color:#111;'> 419.86KB </span>","children":null,"spread":false},{"title":"IEC TR 62258-8:2008 Semiconductor die products - Part 8:EXPRESS model schema for data exchange -完整英文版(28页).pdf <span style='color:#111;'> 1.02MB </span>","children":null,"spread":false}],"spread":true}]