隔离+非隔离双路12V转5V DCDC电源模块设计资料 包含原理图+PCB+AD集成封装库文件

STMicroelectronics STM32 F1全系列PROTEL 99SE 原理图库+PCB封装库文件: STM32F100C4T6B ARM Cortex-M3 32-bit MCU, 16 KB Flash, 4 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 85 degC, Tray STM32F100C4T6BTR ARM Cortex-M3 32-bit MCU, 16 KB Flash, 4 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 85 degC, Tape and Reel STM32F100C4T7B ARM Cortex-M3 32-bit MCU, 16 KB Flash, 4 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 105 degC, Tray STM32F100C6T6B ARM Cortex-M3 32-bit MCU, 32 KB Flash, 4 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 85 degC, Tray STM32F100C6T6BTR ARM Cortex-M3 32-bit MCU, 32 KB Flash, 4 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 85 degC, Tape and Reel STM32F100C6T7B ARM Cortex-M3 32-bit MCU, 32 KB Flash, 4 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 105 degC, Tray STM32F100C8T6B ARM Cortex-M3 32-bit MCU, 64 KB Flash, 8 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 85 degC, Tray STM32F100C8T6BTR ARM Cortex-M3 32-bit MCU, 64 KB Flash, 8 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 85 degC, Tape and Reel STM32F100C8T7B ARM Cortex-M3 32-bit MCU, 64 KB Flash, 8 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 105 degC, Tray STM32F100C8T7BTR ARM Cortex-M3 32-bit MCU, 64 KB Flash, 8 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 105 degC, Tape and Reel STM32F100CBT6B ARM Cortex-M3 32-bit MCU, 128 KB Flash, 8 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 85 degC, Tray STM32F100CBT6BTR ARM Cortex-M3 32-bit MCU, 128 KB Flash, 8 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 85 degC, Tape and Reel STM32F100CBT7B ARM Cortex-M3 32-bit MCU, 128 KB Flash, 8 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 105 degC, Tray STM32F100CBT7BTR ARM Cortex-M3 32-bit MCU, 128 KB Flash, 8 KB Internal RAM, 37 I/Os, 48-pin LQFP, -40 to 105 degC, Tape and Reel STM32F100R4H6B ARM Cortex-M3 32-bit MCU, 16 KB Flash, 4 KB Internal RAM, 51 I/Os, 64-pin TFBGA, -40 to 85 degC, Tray STM32F100R4T6B ARM Cortex-M3 32-bit MCU, 16 KB Flash, 4 KB

STMicroelectronics STM32 F4全系列PROTEL 99SE 原理图库+PCB封装库文件: 'Library Component Count : 135 Name Description ---------------------------------------------------------------------------------------------------- STM32F401CBU6 ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 128 kB Flash, 64 kB Internal RAM, 36 I/Os, 48-pin UFQFPN, -40 to 85 degC, Tray STM32F401CBY6 ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 128 kB Flash, 64 kB Internal RAM, 36 I/Os, 49-pin WLCSP, -40 to 85 degC STM32F401CBY6TR ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 128 kB Flash, 64 kB Internal RAM, 36 I/Os, 49-pin WLCSP, -40 to 85 degC, Tape and Reel STM32F401CCU6 ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 256 kB Flash, 64 kB Internal RAM, 36 I/Os, 48-pin UFQFPN, -40 to 85 degC, Tray STM32F401CCY6TR ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 256 kB Flash, 64 kB Internal RAM, 36 I/Os, 49-pin WLCSP, -40 to 85 degC, Tape and Reel STM32F401RBT6 ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 128 kB Flash, 64 kB Internal RAM, 48 I/Os, 64-pin LQFP, -40 to 85 degC, Tray STM32F401RCT6 ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 256 kB Flash, 64 kB Internal RAM, 48 I/Os, 64-pin LQFP, -40 to 85 degC, Tray STM32F401RCT6U ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 256 kB Flash, 64 kB Internal RAM, 48 I/Os, 64-pin LQFP, -40 to 85 degC, Tray STM32F401VBT6 ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 128 kB Flash, 64 kB Internal RAM, 79 I/Os, 100-pin LQFP, -40 to 85 degC, Tray STM32F401VCT6 ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 256 kB Flash, 64 kB Internal RAM, 79 I/Os, 100-pin LQFP, -40 to 85 degC, Tray STM32F401VCT6U ARM Cortex-M4 32-bit MCU+FPU, 105 DMIPS, 256 kB Flash, 64 kB Internal RAM, 79 I/Os, 100-pin LQFP, -40 to 85 degC, Tray STM32F405OE ARM Cortex-M4 32-bit MCU+FPU, 210 DMIPS, 512 kB Flash, 192 kB Internal RAM, 72 I/Os, 90-pin WLCSP STM32F405OEY6TR ARM Cortex-M4 32-bit MCU+FPU, 210 DMIPS, 512 kB Flash, 192 kB Internal RAM, 72 I/Os, 90-pin WLCSP,

AD中常用封装库文件

基于CH340C设计的USB TYPE-C接口转TTL串口(下载器)AD硬件原理图}+PCB+封装库文件，2层板 设计，可以做为你的学习设计参考。

STC89C52RC TQFP44封装 51单片机最小系统板AD设计硬件原理图+PCB+3D封装库文件，2层板设计，大小为59*82mm,包括AD设计的原理图和PCB及封装库文件，主要如下： Library Component Count : 17 Name Description ---------------------------------------------------------------------------------------------------- 1N5819 肖特基二极管 ATmega32U4 STC单片机 CC 瓷片电容 CE 直插电解电容 CH340G 串口转USB Header 11 11P接插件 Header 16 16P接插件 Header 4 4P接插件 Header 9 9P接插件 KET 7X7 7*7自锁开关 LED-SMD 贴片LED R-8P4R 贴片排阻 R-S 色环电阻 TSW 3x6 3x6轻触开关 USB-5P 微型USB母座 XTAL-2P 2脚无源脚晶振 铜柱大焊盘 铜柱

STM32F407单片机设计以太网接口数据采集板AD硬件原理图+PCB+封装库文件,2层板设计，大小为100*100mm,包括完整的原理图和PCB及封装库文件，可以做为你的设计参考。 主要器件型号如下： Library Component Count : 36 Name Description ---------------------------------------------------------------------------------------------------- CAP NP CAP NP_2_Dup1 CAP NP_Dup2 CAP,MLCC,10uF,+/-10%,X5R,6.3V,SMD0805 CRYSTAL_1 CRYSTAL_2 Cap 无极性电容 Cap Pol 极性电解电容 DS Surface mount schottky diode SOD-323(0805) Package DS1128-09-S8B8X Diode 二极管 FET P MOS HFD4/12-S 双路继电器 Header 2 Header, 2-Pin Header 2X2 Header, 2-Pin, Dual row Header 9 Header, 9-Pin Inductor 电感 LED0 Typical INFRARED GaAs LED MAX485 NPN-S9014-贴片 NPN-S9014-贴片 RES-2 RESISTOR RESISTOR_1 RES,thick film,47KOhm,+/-5%,1/16W,SMD0402 RESISTOR_Dup2 通用厚膜电阻,75K,+/-1%,R0402,1/16W. Res 贴片电阻 1% Res1 Resistor Res2 Resistor Res3 Resistor TLP281 TLV62569DBVR dc-dc可调电源 TRANSMITOR100 T_FLASH_A XL1509 dp83620_1 stm32f4xxz1_0 绿色端子6P 贴片按键 封装库列表： Component Count : 58 Component Name ----------------------------------------------- 1N4001-M1二极管 2.2uH 贴片电感 10uF贴片电解电容50V 0603A 0603a - duplicate 0603LED 1210 1808贴片电容 3225晶振 BAT54C BATTERY CAN_2 dp83620以太网芯片 EC20 HDR1X2 HDR1X4 HDR1X5 HDR2X2 HDR2X4_CEN HDR2X5 HDR2X9 HDR2X10 HR911105A key_3 keya LED3528 m35768 MC29302 MICRO_USB microSIMauto MICROUSB PCBComponent_1 PCBComponent_1 - duplicate PCBComponent_1 - duplicate1 QFN24 QFP144 RJ45插孔 RTL8201F s8550 SDCARD SIP4 SMB SMB_L4.6-W3.6-LS5.3-RD SO-8 SOT-23-5 SOT223 SSOP-20 TLP281 TSOP44 TVS58Y W25Q16 xtal YINPIN 轻触开关6*6*4.5 贴片磁珠0603 贴片电阻1812 整流桥ABS210 整流桥HD01

USB转TTL串口CH340设计带自上电的STC单片机烧录器 PDF原理图+AD版PCB图+3D视图封装库文件，2层板设计，板子大小为64*17mm, 已制作样本，可以做为你的设计参考。

0.1 - 电阻-电容-电感.SchLib 0.2 - 二极管-整流桥.SchLib 0.3 - LED发光二极管.SchLib 0.4 - 三极管.SchLib 0.5 - 场效应管-可控硅.SchLib 0.6 - 数码管-TFT-OLED屏.SchLib 0.7 - 常用按键-开关.SchLib 0.8 - 以太网-音频-USB插座.SchLib 0.9 - 电路模块.SchLib 1.0 - 常见芯片.SchLib 1.1 - 电源类芯片.SchLib 1.2 - 传感元件.SchLib 1.3 - CD4000系列芯片.SCHLIB 1.4 - 74系列TTL芯片 ....

TMS320F28234DSP开发板ALTIUM设计硬件原理图+PCB+封装库文件,2层板设计，大小为116*89mm,包括AD设计的原理图和PCB及封装库文件 TMS320F28234最小系统板文档说明 1. 电源部分 系统板供电电源为+5V，电源接插件为2510.DSP核心电压1.9V（150MHz），IO逻辑电平3.3V，模拟部分+5V，其中DSP部分的电源由TPS70302降压后得到，模拟电路电源直接由输入的+5V电源提供。 2. DSP部分 设置有Jtag下载口，复位按键，SCI接口（串口）。并引出32个IO口，8路AD采样接口，4路PWM接口。  IO口 GPIO49 P6_11 GPIO65 P7_14 GPIO40 P9_1 GPIO50 P6_12 GPIO66 P7_15 GPIO41 P9_2 GPIO51 P6_13 GPIO67 P7_16 GPIO42 P9_3 GPIO52 P6_14 GPIO68 P7_17 GPIO43 P9_4 GPIO53 P6_15 GPIO69 P7_18 GPIO44 P9_5 GPIO54 P6_16 GPIO70 P7_19 GPIO45 P9_6 GPIO55 P6_17 GPIO71 P7_20 GPIO46 P9_7 GPIO56 P6_18 GPIO72 P7_21 GPIO47 P9_8 GPIO57 P6_19 GPIO73 P7_22 GPIO80 P9_9 GPIO58 P6_20 GPIO74 P7_23 GPIO81 P9_10 GPIO64 P7_13 GPIO75 P7_24  ADCIN为ADCBIN0至ADCIN8：P5_1至P5_8  SCI为P4，P4_1为DGND，P4_2为SCIRXDB,P4_3为SCITXDB  PWM EPWM2B P8_1 EPWM3A P8_2 EPWM3B P8_3 EPWM4A P8_4 P8_5为AGND 3. 模拟部分 EPWM2A信号经OPA354组成的LPF后，由P21输出至带阻网络。经由带阻网络的信号由P22接至OPA364后，由 ADCINA0采入。 其中P10为PWM信号的测试探针，P12为ADCINA0的测试探针。 均衡后的信号由EPWM1A输出，经滤波后接至50欧负载，P11为测试探针。