This paper presents power management guidelines for PCI Express links on Intel-based Mobile platforms. It describes the mapping from platform sleeping states and device power states to link power states, including the procedure to support Mobile-specific S1/POS and CPU C3/C4 scenarios. Device and platform power saving opportunities are identified for each link power state. L1 entry policy is also recommended to optimize device power. Several power optimization techniques are described, including minimizing flow control updates and acknowledgement packets to improve bandwidth efficiency, and pipelining packets to increase opportunities for active state link power management. These power management guidelines enable architectural innovation to achieve power-optimized interconnect performance.

PCI Express Base Specification Revision 2.0 协议规范

1. INTRODUCTION............................................................................................................... 46 1.1. A THIRD GENERATION I/O INTERCONNECT ................................................................... 46 1.2. PCI EXPRESS LINK......................................................................................................... 49 1.3. PCI EXPRESS FABRIC TOPOLOGY .................................................................................. 50 1.3.1. Root Complex........................................................................................................ 50 1.3.2. Endpoints .............................................................................................................. 51 1.3.3. Switch .................................................................................................................... 54 1.3.4. Root Complex Event Collector .............................................................................. 55 1.3.5. PCI Express to PCI/PCI-X Bridge........................................................................ 55 1.4. PCI EXPRESS FABRIC TOPOLOGY CONFIGURATION ....................................................... 55 1.5. PCI EXPRESS LAYERING OVERVIEW.............................................................................. 56 1.5.1. Transaction Layer ................................................................................................. 57 1.5.2. Data Link Layer .................................................................................................... 57 1.5.3. Physical Layer ...................................................................................................... 58 1.5.4. Layer Functions and Services............................................................................... 58 TRANSACTION LAYER SPECIFICATION ................................................................. 62 2.1. TRANSACTION LAYER OVERVIEW.................................................................................. 62 2.1.1. Address Spaces, Transaction Types, and Usage................................................... 63 2.1.2. Packet Format Overview ...................................................................................... 65 2.2. TRANSACTION LAYER PROTOCOL - PACKET DEFINITION............................................... 67 2.2.1. Common Packet Header Fields ............................................................................ 67 2.2.2. TLPs with Data Payloads - Rules ......................................................................... 70 2.2.3. TLP Digest Rules .................................................................................................. 74 2.2.4. Routing and Addressing Rules .............................................................................. 74 2.2.5. First/Last DW Byte Enables Rules........................................................................ 78 2.2.6. Transaction Descriptor ......................................................................................... 81 2.2.7. Memory, I/O, and Configuration Request Rules................................................... 87 2.2.8. Message Request Rules ......................................................................................... 94 2.2.9. Completion Rules ................................................................................................ 115 2.2.10. TLP Prefix Rules ................................................................................................. 118 2.3. HANDLING OF RECEIVED TLPS.................................................................................... 123 2.3.1. Request Handling Rules...................................................................................... 126 2.3.2. Completion Handling Rules................................................................................ 138 2.4. TRANSACTION ORDERING ............................................................................................ 142 2.4.1. Transaction Ordering Rules ............................................................................... 142 ......

PCIe3.0协议规范原文件

'We have always recommended these books to our customers and even our own engineers for developing a better understanding of technologies and specifications. We find the latest PCI Express book from MindShare to have the same content and high quality as all the others.' --Nader Saleh, CEO/President, Catalyst Enterprises, Inc. PCI Express is the third-generation Peripheral Component Inter-connect technology for a wide range of systems and peripheral devices. Incorporating recent advances in high-speed, point-to-point interconnect

NVM Express and the PCI Express* SSD RevolutionSSDS003Danny Cobb, CTO Flash Memory Business Unit, EMC Amber Huffman, Sr. Principal Engineer, Intel2Agenda• NVM Express (NVMe) Overview• New NVMe Features in Enterprise & Client• Driver Ecosystem for NVMe• NVMe Interoperability and Plugfest Plans• EMC’s Perspective: NVMe Use Cases and Proof PointsThe PDF for this Session presentation is available from our Technical Session Catalog at the end of the day at:intel.com/go/idfsessions URL is on to

介绍固态硬盘的架构及pcie接口的一本书。 对于ssd的了解有帮助

MindShare_PCI Express Technology 3.0.pdf

M.2接口的详细手册，里面有详细的介绍，包括接插件封装、板卡尺寸等等

PCIE1.0-3.0规范解读，从硬件接口到上层应用，生动而详细的对规范进行了解读；有助于相关从业者对协议进行人如了解，和作为标准协议的导读文本