物联网开发实战-家庭温湿度计的实现，基于esp8266 mq135传感器 DHT11传感器 OLED屏幕 https://www.jianshu.com/p/0098f2e0ae33

STM32L475VGT6物联网开发板ALTIUM设计硬件原理图PCB+AD集成封装库文件，4层板设计，大小为90x62mm，Altium Designer 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，可作为你产品设计的参考。集成封器件型号列表： Library Component Count : 46 Name Description ---------------------------------------------------------------------------------------------------- 1050170001 USB-MICRO-B, 1050170001, SMT, MOLEX 475900001 USB-MICRO-AB, 47590-0001, SMT, MOLEX BAT60JFILM BAT60JFILM BSR14 BSR14 NPN switching transistor SOT23 (Marking U8) CAP_NPOL Capacitor_not polarized EMIF02-USB03F2 2-line IPAD, EMI filter including ESD protection HEADER_2X5 HEADER_2X6_PMOD PMOD Connector Warning Specific Pinout HTS221 Humidity + Temp MEMS Header 10X1_Female_SMDHeader, 10-Pin, SMD, Single row,female Header 2 pins Header 2 pins Header 4 Header, 4-Pin Header 6X1_Female_SMDHeader, 6-Pin, SMD, Single row,female Header 8X1_Female_SMDHeader, 8-Pin, SMD, Single row,female ISM43362-M3G-L44 ISM43362-M3G-L44 Wifi Module 802.11 bgn Inductor Inductor LD1117S33TR LOW DROP FIXED AND ADJUSTABLE POSITIVE VOLTAGE REGULATORS (3.3 Volts) LD1117S50TR IC REG LDO 5V 0.8A SOT223 LD3985M33R Ultra low drop-low noise BiCMOS voltage, regulators low ESR capacitors compatible LD_BICOLOR_CMS Bicolor Led LED Light-Emitting Diode LIS3MDL IC,Sensor LPS22HB IC,Sensor LSM6DSL Accelero + Gyro MEMS (6 Axis) LT1963EST-3.3 LT1963EST-3.3 LDO Low Noise 1.5A fast Transient Response M24SR64-Y M24SR64-Y 64K_EEPROM NFC/RFID MP34DT01 MEMS audio microphone MX25R6435F MX25R6435F Serial Flash Memory 64M PT Point de test RES Resistor SPBTLE-RF SPBTLE-RF SPSGRF SPSGRF-915or SPSGRF-868 ST890CDR 1.2 A current limited high-side power switch with thermal shutdown STM32F103CBT6 Medium-density performance

STM32L475VGT6单片机物联网开发板PDF原理图PCB+AD集成封装库文件, ALTIUM工程转的PDF原理图PCB文件+AD集成封装库，已在项目中验证，可以做为你的设计参考。集成封装库器件列表： Library Component Count : 46 Name Description ---------------------------------------------------------------------------------------------------- 1050170001 USB-MICRO-B, 1050170001, SMT, MOLEX 475900001 USB-MICRO-AB, 47590-0001, SMT, MOLEX BAT60JFILM BAT60JFILM BSR14 BSR14 NPN switching transistor SOT23 (Marking U8) CAP_NPOL Capacitor_not polarized EMIF02-USB03F2 2-line IPAD, EMI filter including ESD protection HEADER_2X5 HEADER_2X6_PMOD PMOD Connector Warning Specific Pinout HTS221 Humidity + Temp MEMS Header 10X1_Female_SMDHeader, 10-Pin, SMD, Single row,female Header 2 pins Header 2 pins Header 4 Header, 4-Pin Header 6X1_Female_SMDHeader, 6-Pin, SMD, Single row,female Header 8X1_Female_SMDHeader, 8-Pin, SMD, Single row,female ISM43362-M3G-L44 ISM43362-M3G-L44 Wifi Module 802.11 bgn Inductor Inductor LD1117S33TR LOW DROP FIXED AND ADJUSTABLE POSITIVE VOLTAGE REGULATORS (3.3 Volts) LD1117S50TR IC REG LDO 5V 0.8A SOT223 LD3985M33R Ultra low drop-low noise BiCMOS voltage, regulators low ESR capacitors compatible LD_BICOLOR_CMS Bicolor Led LED Light-Emitting Diode LIS3MDL IC,Sensor LPS22HB IC,Sensor LSM6DSL Accelero + Gyro MEMS (6 Axis) LT1963EST-3.3 LT1963EST-3.3 LDO Low Noise 1.5A fast Transient Response M24SR64-Y M24SR64-Y 64K_EEPROM NFC/RFID MP34DT01 MEMS audio microphone MX25R6435F MX25R6435F Serial Flash Memory 64M PT Point de test RES Resistor SPBTLE-RF SPBTLE-RF SPSGRF SPSGRF-915or SPSGRF-868 ST890CDR 1.2 A current limited high-side power switch with thermal shutdown STM32F103CBT6 Medium-density performance line ARM-based 32-bit MCU with 128KB Flas

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STM32L475VGT6 物联网开发板硬件ALTIUM设计原理图+PCB+BOM，采用4层板设计，板子大小为90x62mm，双面布局布线，该物联网开发板基于M24SR的动态NFC标签，带NFC印刷天线；同时支持BLE、NFC、SubGHz、Wi-Fi等。AltiumDesigner 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，可作为你产品设计的参考。

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