i.MX-RT1052+PSRAM智能面板控制板ALTIUM设计硬件原理图+PCB+AD集成封装库,4层板设计,大小为93x85mm,Altium Designer 设计的工程文件,包括完整的原理图及PCB文件,可以用Altium(AD)软件打开或修改,可作为你产品设计的参考。集成封装器件型号列表: Library Component Count : 61 Name Description ---------------------------------------------------------------------------------------------------- 74LVC1G125 74LVC1G125GV,SOT-23,NXP,RoHS AHT10 APS12808L-OB-BA APS12808L-OB-BA,miniBGA 24L,apmemory APS12816G-D-XBF APS12816G-D-XBF,54-Ball VFBGA,apmemory APS6404L-3SQN APS6404L-3SQN-SN,SOP8,apmemory AW-NM372SM_REV01 AW-NM372SM,SMT,AzureWAVE BATTERY 2P,间距1.25mm,Wafer凹槽边框,90°,FPC2-49T BNC Connector5 U.FL-R-SMT-1(80),SMT,HIROSE BT11P_REVC BT11P,Rev.C,L2,0.8*88*97,FR4-170,ENIG,GN,1@20 BUZZER2 AS-905I-LF,无源,Ф9×4.8mm,常州立翔,RoHS CAP1 102,±10%,2KV,X7R,1206,*,RoHS CAT4139 CAT4139TD,SOT-23-5,ON,RoHS CAT6219 CAT6219-180TD-GT3,TSOT-23-5,ON, CAT823 CAT823STDI-GT3,TSOT-23-5,ON,RoHS CON2 2.5-2T,180°,PA46本色,WF2501-WSH02T02,WCON,RoHS CON4 Connector CON5 Connector CON7 Connector DIODE SCHOTTKY MBR0520LT1G,SOD-123,ON,RoHS DIODE ZENER2 SMBJ6.5CA,DO-214AA,君耀,RoHS DIODE-D BAT54C,共阴,200mA,30V,SOT-23-3,NXP,RoHS DIODE1 1N4148,SOD-323,RoHS ESD-1D PESD5V0S1BA,SOD-323,NXP,RoHS ESD-3 PESD3V3S2UT,SOT-23,NXP,RoHS ESD-MARK FUSE1 SMD200,1812,RoHS HEADER 5X2 HOLE - 不上螺丝 INDUCTOR1 SP53-2R2M,2.2μH,3.5A,5.2×5.8×3.2mm,SMD,科达嘉,RoHS IS25LP064A-JBLE IS25LP064A-JBLE,ISSI,SOIC-8,RoHS JMP2 LED1 0603QRC,红色,0603,创光,RoHS MARKER MIMXRT1052CVL5A MOSFET-N3 AO3400A,SOT-23,AOS,RoHS MOSFET-P1 IRLML6402,SOT-23,IR,RoHS MP1653 MP1653GTF-Z,SOT563,MPS NPN-1 SS8050LT(1.5A),SOT-23,江苏长电,RoHS PCB_ANTENNA_APPS PCF8563
i.MX-RT1052+SDRAM智能面板控制板ALTIUM设计硬件原理图+PCB+AD封装库+BOM+关键器件手册,4层板设计,大小为84x83mm,Altium Designer 设计的工程文件,包括完整的原理图及PCB文件,可以用Altium(AD)软件打开或修改,可作为你产品设计的参考。主板器件型号列表: ibrary Component Count : 59 Name Description ---------------------------------------------------------------------------------------------------- 74LVC1G125 74LVC1G125GV,SOT-23,NXP,RoHS AHT10 AW-NM372SM_REV01 AW-NM372SM,SMT,AzureWAVE BATTERY 2P,间距1.25mm,Wafer凹槽边框,90°,FPC2-49T BNC Connector5 U.FL-R-SMT-1(80),SMT,HIROSE BT11P_REVC BT11P,Rev.C,L2,0.8*88*97,FR4-170,ENIG,GN,1@20 BUZZER2 AS-905I-LF,无源,Ф9×4.8mm,常州立翔,RoHS CAP1 102,±10%,2KV,X7R,1206,*,RoHS CAT4139 CAT4139TD,SOT-23-5,ON,RoHS CAT6219 CAT6219-180TD-GT3,TSOT-23-5,ON, CAT823 CAT823STDI-GT3,TSOT-23-5,ON,RoHS CON14 0.5FFC-12P,上掀下接,SMD,众盈畅,RoHS CON2 2.5-2T,180°,PA46本色,WF2501-WSH02T02,WCON,RoHS CON5 Connector CON7 Connector DIODE SCHOTTKY MBR0520LT1G,SOD-123,ON,RoHS DIODE ZENER2 SMBJ6.5CA,DO-214AA,君耀,RoHS DIODE-D BAT54C,共阴,200mA,30V,SOT-23-3,NXP,RoHS DIODE1 1N4148,SOD-323,RoHS ESD-1D PESD5V0S1BA,SOD-323,NXP,RoHS ESD-3 PESD3V3S2UT,SOT-23,NXP,RoHS ESD-MARK FUSE1 SMD200,1812,RoHS HEADER 5X2 HOLE - 不上螺丝 INDUCTOR1 SP53-2R2M,2.2μH,3.5A,5.2×5.8×3.2mm,SMD,科达嘉,RoHS IS25LP064A-JBLE IS25LP064A-JBLE,ISSI,SOIC-8,RoHS IS42S16160J-7TLI IS42S16160J-7TLI,TSOP-54,ISSI JMP2 LED1 0603QRC,红色,0603,创光,RoHS MARKER MIMXRT1052CVL5A MOSFET-N3 AO3400A,SOT-23,AOS,RoHS MOSFET-P1 IRLML6402,SOT-23,IR,RoHS MP1653 MP1653GTF-Z,SOT563,MPS NPN-1 SS8050LT(1.5A),SOT-23,江苏长电,RoHS PCB_ANTENNA_APPS PCF8563 PCF85063AT,SO8,NXP,RoHS PESD24VL2BT PESD5V0L2BT,SOT-23,NXP,RoHS PRTR5V0U2X PRTR5V0U2X,SOT-143B,NXP,RoHS PRTR5V0U2X
AC220V转DC5V(3W )-RS485电路-继电器驱动板ALTIUM设计硬件原理图+PCB+AD集成封装库,2层板设计,大小为59x62mm,Altium Designer 设计的工程文件,包括完整的原理图及PCB文件,可以用Altium(AD)软件打开或修改,可作为你产品设计的参考。集成封装器件型号列表: Library Component Count : 20 Name Description ---------------------------------------------------------------------------------------------------- CAP1 GRM21BR61A106KE19L,106,10μF,±10%,10V,X5R,0805,muRata,RoHS CON2 Connector CON3 Connector CON4 Connector DIODE ZENER2 SMBJ6.5CA,DO-214AA,君耀,RoHS DIODE1 1N4148,SOD-323,长电,RoHS FUSE1 MST2.50,T2.5A,250V,长方形,CONQUER,RoHS HEADER 5X2 HOLE - 不上螺丝 MARKER MAX485CSA SP485REN-L,SO-8,EXAR,RoHS NPN-1 9013,SOT-23,长电,RoHS RELAY-SPST HF46F/005-HS1,20.5×7.2×15.3mm,宏发,RoHS RES-PTC NTC,5D-9,DIP,RoHS RES2 10Ω,0603,*,RoHS RES4 471KD10,直插,君耀,RoHS ZLG ZY GAOYA ZY0IFBxxP-3W ZY0IGB05P-3W V1.00 ZY_ESD-MARK
高性能DSP的声控处理芯片LS416语音识别模块ALTIUM设计硬件原理图+PCB+BOM+器件手册,2层板设计,大小为40x45mm,Altium Designer 设计的工程文件,包括完整的原理图及PCB文件,可以用Altium(AD)软件打开或修改,可作为你产品设计的参考。器件型号列表: Library Component Count : 11 Name Description ---------------------------------------------------------------------------------------------------- CAP1 GRM188D71A106MA73D,0603,Murata,10μF,X7T,±20%,10V CON12 Connector CON2 Connector CON3 Connector CON4 Connector HOLE - 不上螺丝 LS416_M_26P MARKER USB_MINIB_SMT2 ST-USB-002B-1,SMT,SUNGTECH,MicroUSB-A W02_M_30P
18位电流输出DAC模块LTC2756评估板AD设计硬件原理图pcb+AD集成封装库+BOM文件,2层板设计,Altium Designer 设计的工程文件,包括完整的原理图及PCB文件,可以用Altium(AD)软件打开或修改,已制样板测试验证,可作为你产品设计的参考。集成封器件型号列表: Library Component Count : 14 Name Description ---------------------------------------------------------------------------------------------------- AD8397ARDZ Imported Capacitor CAP.,1uF,X74,10V,10%,1206 Header 10X1 2.54 Header, 100mil, 2x1_1Header, 100mil, 2x1, Tin plated, TH Header, 100mil, 3x1 Header, 100mil, 3x1, Tin plated, TH KJDZ-2 快接端子 LT1012 LT1012 LT1360 LT1360 LTC2054_1 LTC2054 LTC2756AIG LTC2756AIG LTC6244 Imported LTC6655 LTC6655 Resistor RES.,1K OHMS,5%,1/16W,0603 SMA-KE CONNECTOR, SHEILDED, END LAUNCH JACK, GOLD PLATED, FOR 0.062 PCB, EDGE MOUNTED
OV2640摄像头模块AD设计硬件原理图+PCB文件
2021-04-06 20:08:00 461KB OV2640摄像头模块AD设计硬
基于DSP设计的数字化大功率电源数字化全桥变换器电源ALTIUM设计硬件原理图+PCB文件,包括主板和控制板2个硬件,均为4层板设计,ALTIUM设计的硬件工程文件,包括完整的原理图和PCB文件,可以做为你的设计参考。 主板器件封装: Component Count : 64 Component Name ----------------------------------------------- 0603CL 0603RL 0603rl - duplicate 0805-100V 0805CL 0805cl - duplicate 0805RL 1206 1206CL 1206RL 1210 1812 2512 3225[1210] 6332[2512] BR_RS25XX C822j823聚丙烯 CAP3 CAP11-8 CAP22.5*10 CD1 CD1B CD1S CD2 CD2.5-6.3 CY1 DG8*8*15 DIP04-SMD DO-35 EC28/34w F5*30*40 HOL HOL3.5 HU JQX-115F-I L101_1 L103 MICRO8 PPTC5-8.3 RAD0.4 RAD2W5 SIP03-5.08-MG127 SIP04-2.0 SIP06-2.0 SIP07-2.0 SIZE A SMA4.32X2.6 SMB SMB3.8X7 SOIC8 SOIC8-PP SOIC14 SOT23 SOT23/L1.9 SOT223 T2.75X8 TO-220AB-1 TO-220L TO-220VSBCE TO-220VSEBC TO-247 T谐振电感 uu9.8 U型槽3.5X7
nxp imx6uL MCIMX6UL BB开发板Cadence allegro设计硬件原理图+PCB+BOM文件
nxp imx6ull MCIMX6ULL官方开发板Cadence allegro设计硬件原理图+PCB+BOM文件
1拖4端口USB3.0 hub ALTIUM设计硬件原理图PCB+BOM+USB3.0扁口座封装+VL812 芯片技术资料包,USB3.0 HUB,usb3.0一分四集线器,采用VL812方案,性能稳定,可以做为你的设计参考。 文档资料: 812_9044_BC_Setup_20130329.exe DS_VL812(B1)_099.pdf S-Speed_PCB_Design_Guide_Lines_r13.pdf uPD720210_USB3.0布线指导.pdf VL811+&VL812_Firmware_904X_Release_Notes.pdf VL812 B2 的DS 和變更事項 VL812 QFN76 HUB P4 BC DEMO.pdf VL812 USB3.0 Hub for Low Power Test Report_V1.2.pdf VL812 USB3.0 hub硬件设计原理图+PCB VL812_QFN76_HUB_P4_BC_DEMO.pdf 元件清单.xlsx