The Cadence:registered: Allegro:registered: system interconnect design platform enables collaborative design of high-performance interconnect across IC, package, and PCB domains. The platform's constraint-driven flow and co-design methodology optimizes system interconnect between I/O buffers and across ICs, packages, and
2023-10-15 15:58:08
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Eclipse Rich Client Platform: Designing, Coding, and Packaging Java™ Applications。RCP开发必备！
2023-09-06 22:19:58
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aapt工具（Android Asset Packaging Tool）
2022-12-21 09:20:05
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Spartan-6 FPGA Packaging and Pinouts
2022-08-17 16:03:20
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中英文两个版本，关于Debian deb包制作教程的官方文档。如果dpkg-buildpackage编译源码包细则等。中英文文档每份89页，读者可以对照看下。拿1积分好了，不知道之后会不会上调。
2022-07-21 12:00:34
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官方离线安装包，测试可用。使用rpm -ivh [rpm完整包名] 进行安装
2022-01-05 20:01:42
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Eclipse Rich Client Platform Designing Coding and Packaging Java Applications.pdf 富客户端开发文档
2021-12-20 11:17:34
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