iMX6Q CORTEX-A9四核工业开发板10层板PDF原理图PCB+3D封装库文件， ALTIUM工程转的PDF原理图PCB文件+AD集成封装库，已在项目中验证，可以做为你的设计参考。 3D封装库列表： Component Count : 78 Component Name ----------------------------------------------- 4-1734592-0 6_DFN_3MMX3MM 7M 8_SOIC_3.9MM 16-TQFN_3mmx3mm_V1.1 56-VFQFN EP 96_FPGA_DD3_14MMX10MM-SMALL_SIZE 0532610471 693071010811 ABM8 ABM8G ABS06 ACM2012 C0201 C0402 C0603 C0603_small C0805 C1206 - TLN S CASE TANTAL C2312 C2917 DBV_SOT_23_6 ESQ-120-14-G-D ESQ-120-14-G-S FC68125 FID_40X52D HDMI V1.1 HDR_1X2_2.54MM HDR_1X6_2.54MM HVQFN33_7X7MM IFSC_79MILX98MIL IHLP_118MILX144MIL IHLP_160MILX175MIL IHLP_204MILX216MIL L829-1J1T-43 LED_0603 MH_5MMD_2MMD MH_7.4MMD_3.2MMD MICRO_SD_CARD MICRO_SIM_CARD MINI_PCIE_52PIN_CARD_CON MINI_PCIE_52PIN_CARD_LATCH MINI_PCIE_FULL CARD MLF_3X3_12PINS MSOP8 _SMALLER PBGA624 POWER_JACK_5.5_2.1MM_NS_V1.1 QFN16_3X3MM QFN24_4X4MM QFN32 5x5x0.85_V1.1 QFN36_6MMX6MM QFN48_SMALL_EP_7MMX7MM R0201 R0402 R0805_SMALL R1206 RGY (R-PVQFN-N16) SATA_VERTICAL SC70_5 SC70_6 SC70_SOT323 SIM_MICRO_HINGED SMC SOD-123FL SOD323 SOT-23-3-123 SOT23-6_DBV6 SOT143 SOT363 SOT665 TACT_SMD TP_25C TSOP382 TSSOP_38 USB_MICRO_AB USB-2A WSON8_6X5MM ZIF_RA_BOTTOM_15X1MM

iMX6Q CORTEX-A9四核 OpenRex工业开发板ALTIUM设计硬件原理图+PCB+封装库+BOM文件，采用10层板设计，板子大小为70x95mm，双面布局布线。主要器件为MCIMX6Q5EYM10AC，'MT41J256M16HA-125:E，'LPC1345FHN33,551-ND，'MMPF0100NPAEP，'SGTL5000XNAA3R2，MIC33050-4YHL TR，'ISL8024AIRTAJZ-T7A，'TJA1040T等 Altium AD设计硬件原理图+PCB工程文件，ad 设计的工程文件，包括原理图及PCB印制板图.