Silicon Labs IDE 开发环境

TI TDA3X 芯片手册 TDA3x is an ADAS applications device based on enhanced OMAP™ architecture integrated on a 28-nm technology. TDA3x complements the TDA2x ADAS device family by using a common architecture, enabling scalability from entry to high performance for a broad range of applications. • The device family is targeted at ADAS applications including Front Camera, Intelligent Rear Camera, Radar and Mirror Replacement.

Shenzhen_Spreadview_Century_Technologies_Co,_Ltd__SiI-DS-1107-0.80

silicon 单片机C8051F320的I2C总线控制程序

Silicon Lab SI47XX PROGRAMMING GUIDE， AN332。 Si47xx系列FM芯片编程指引。

集成电路工艺：Deep-submicron process technology Describe such deep-submicron process technology and intended to provide semiconductor engineers and researchers with a comprehensive , state-of-the-art reference about these emerging and leading-edge process.

Silicon Processing for the VLSI Era (III)

硅基集成电路工艺：process technology provide a comprehensive and up-to-date treatment of this important and rapidly changing field.

和SI4432不同，SILICON公司的其它很多RF的寄存器采用了网页模式的方法取代了PDF来说明寄存器，，，好处是方便查找吧

适用于 Apple Silicon M1 的温度传感器监视器 temp_sensor.m： freedomtan对 iOS 传感器的 Objective-C代码进行了修改； monitor.pytemp_sensor.m：用于监控终端温度的输出包装器。 用法 编译temp_sensor.m（通过clang -Wall -v temp_sensor.m -framework IOKit -framework Foundation -o temp_sensor，需要 M1 mac 上的 Xcode）。然后 ./temp_sensor | ./monitor.py或者./temp_sensor 只用我的 Macbook air 和 M1 进行测试。如果需要，请检查您的 macioreg -lfx输出以进行更改。temp_sensor. 更多详情、使用方法，请下载后细读README.md文件