Preface Printed Circuit Board Design Techniques for EMC Compliance: A Handbook for Designers, Second Edition, is a significant enhancement to the first edition. The first edition was well received within the engineering community worldwide and was translated into international languages. The intent of the present volume is to expand upon concepts presented in the earlier edition, to justify why a specific design technique works, and to show when it is appropriate for use. Additional techniques based on technological changes within the last few years are also incorporated. These techniques and enhancements are based on questions, comments, and discussions received from engineers around the world. This book presents information never before published within the engineering community, dealing exclusively with printed circuit boards (PCBs). When writing the first edition, it was impossible to anticipate the amount of variations possible, or what the intended audience expected from a book directed toward nondegreed engineers. A thorough understanding of the concepts presented herein will assist during the design and layout process. Note the key word here —"concepts." Printed Circuit Board Design Techniques for EMC Compliance will help minimize the emission or reception of unwanted radio frequency (RF) energy generated by components and circuits, thus achieving acceptable levels of electromagnetic compatibility (EMC) for electrical equipment. The field of EMC consists of two distinct areas: 1. Emissions: Propagation of electromagnetic interference (EMI) from noncompliant devices (culprits) and, in particular, radiated and conducted electromagnetic interference. 2. Susceptibility or immunity: The detrimental effects on susceptible devices (victims) in forms that include EMI, electrostatic discharge (ESD), and electrical overstress (EOS). The primary goal of the engineer is to ensure proper operation and performance of a product when used within an intended electromagnetic environment. These design requirements are in addition to making a product function as desired for use within a specific, end-use environment. Information presented in this guideline is intended for those who design and layout printed circuit boards. EMC and compliance engineers will also find the information presented herein helpful in solving design problems at both the PCB and system level. This book can be used as a reference document for any design project. The focus of this book is strictly on the PCB. Containment techniques (shielding), internal and external cabling, power supply design, and other system-level subassemblies that use PCBs as a subcomponent will not be discussed. Again, as in the first edition, excellent reference material on these aspects of EMC system-level engineering is listed in the References section at the ends of chapters.

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