Oscar 物联网开发板 基于GD32F130C8T6为主控设计的物联网开发板,板载丰富的芯片/模块,涵盖了UART/SPI/I2C/ADC等外设接口,通过学习使用Oscar 开发板,用户可快速入门GD32F130系列芯片的基础操作; ESP8285 Wi-Fi 模块 CP2102 USB串口 电压电流测量电路 128kb 串行Flash 3.2寸SPI串行TFT 液晶触摸屏 2个按键,可唤醒主控 小型贴片蜂鸣器 USB供电过流保护设计 项目开源资料: 硬件外观
2023-02-24 20:19:20 74.65MB c iot pcb gd32
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ESP12F是一个经典的WiFi模块,该模块可以通过无线数据发送进行通信
2022-05-02 19:44:40 7.22MB 物联网 物联网开发板 电路方案
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本项目分享LinkIt 7697 HDK物联网开发板原理图/PCB源文件/用户手册等,供网友下载。LinkIt 7697 HDK是基于联发科MT7697 SoC的物联网(IoT)应用开发板,支持Wi-Fi和蓝牙低功耗连接。MT7697芯片基于具有FPU的ARM Cortex-M4处理器,具有802.11b / g / n Wi-Fi和蓝牙4.2低能量连接功能。LinkIt 7697 HDK物联网开发板实物结构图: LinkIt 7697 HDK物联网开发板特点: 基于ARM Cortex-M4的MT7697 SoC @ 192MHz 802.11b / g / n无线连接 蓝牙4.2低能量 352 KB的RAM 4 MB外部闪存 微型USB端口供电 虚拟COM端口通过板载CP2102N USB转UART芯片组 两个按钮用于系统复位和外部中断 外围接口包括GPIO,UART,I2C,SPI,PWM,EINT,ADC,IrDA,I2S 针脚用于SWD调试 LinkIt 7697 HDK物联网开发板引脚排列图: LinkIt 7697 HDK物联网开发板电路 PCB截图,用eagle打开:
2022-01-24 19:58:14 6.34MB 物联网 linkit 7697 mt7697
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欢迎下载研华科技主题白皮书: 【AIoT】研华AIoT边缘智能及网关解决方案 [摘要] 物联网、大数据、云服务与人工智能,是产业数位转型的关键科技趋势,透过创新应用,将替各产业带来巨大商机与全新 局面。研华以坚强的硬件实力为基础,开发出多元软件服务。 https://www.eefocus.com/resource/advantech/index.p... STM32L475VGT6 物联网开发板,官方为之命名为IoT node。该IOT物联网开发板基于M24SR的动态NFC标签,带NFC印刷天线;同时支持BLE、NFC、SubGHz、Wi-Fi等。由于该STM32L475VGT6 物联网开发板支持Arduino Uno V3和PMOD连接,因此可提供无限的扩展能力,即提供海量的专用附加板选择。STM32L475VGT6 物联网开发板实物截图: 附件内容截图:
2021-09-27 16:12:17 11.43MB 物联网 stm32l475vgt6 m24sr 电路方案
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STM32L475VGT6 物联网开发板资料+应用_硬件设计.zip
2021-05-19 09:19:39 8.17MB 文档
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ESP-01 ESP-07 ESP-07S ESP-12S ESP-12F相关及入门资料
2021-04-29 01:35:54 167.5MB 嵌入式 模块 单片机
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ALIENTEK_W601 WIFI物联网开发板PDF原理图+AD集成3D封装库+主要器件技术手册, AD集成库器件型号列表: Library Component Count : 32 Name Description ---------------------------------------------------------------------------------------------------- ANT-2.4G ANT,2.4G,PCB天线 ATK_MODULE 单排母,1*6,2.54mm BEEP 3.3V有源蜂鸣器 BUTTON_DIP3 拨动开关SS-12F44 C-0402-SMD C-0603-SMD C-0805-SMD C-CAP-SMD-220uF/10V D-1N4148 Header-2*2-2.54mm 双排针-2.54mm Header-2*3-2.54mm 双排针-2.54mm Header-2*9-2.54mm 双排针-2.54mm IR-LED 1206红外发射管(侧) IR-LF0038GKLL-1 红外接收管SMD J-MICRO-USB-5S MICRO-USB,SMD J-XH2.54-4P-DIP XH2.54端子-DIP LCD-TFT-H13TS38A LCD,TFT,1.3'240*240,禹龙 LDO-AMS1117-3.3 LDO,1A LED-0603-RED 发光二极管-红色 LED-RGB-1615-0603 RGB,共阳,1615,0603 R-0402-SMD 贴片电阻 R-0603-SMD 贴片电阻 R-0805-SMD 贴片电阻 S-KEY-SMD-324225 KEY,SMD,324225 S8050-SMD SD-MICRO-TF SD,MICRO,TF U-AHT10 Sensor,温湿度传感器 U-AP3216C Sensor.光照/距离 U-CH340N USB转TTL,内置晶振 U-W25Q128 SPI FLASH,16M U-W601 WIFI.CM3,80MHz,288K RAM,1M FLASH Y-12M-SMD 晶振 - 12M贴片
STM32L475VGT6物联网开发板ALTIUM设计硬件原理图PCB+AD集成封装库文件,4层板设计,大小为90x62mm,Altium Designer 设计的工程文件,包括完整的原理图及PCB文件,可以用Altium(AD)软件打开或修改,可作为你产品设计的参考。集成封器件型号列表: Library Component Count : 46 Name Description ---------------------------------------------------------------------------------------------------- 1050170001 USB-MICRO-B, 1050170001, SMT, MOLEX 475900001 USB-MICRO-AB, 47590-0001, SMT, MOLEX BAT60JFILM BAT60JFILM BSR14 BSR14 NPN switching transistor SOT23 (Marking U8) CAP_NPOL Capacitor_not polarized EMIF02-USB03F2 2-line IPAD, EMI filter including ESD protection HEADER_2X5 HEADER_2X6_PMOD PMOD Connector Warning Specific Pinout HTS221 Humidity + Temp MEMS Header 10X1_Female_SMDHeader, 10-Pin, SMD, Single row,female Header 2 pins Header 2 pins Header 4 Header, 4-Pin Header 6X1_Female_SMDHeader, 6-Pin, SMD, Single row,female Header 8X1_Female_SMDHeader, 8-Pin, SMD, Single row,female ISM43362-M3G-L44 ISM43362-M3G-L44 Wifi Module 802.11 bgn Inductor Inductor LD1117S33TR LOW DROP FIXED AND ADJUSTABLE POSITIVE VOLTAGE REGULATORS (3.3 Volts) LD1117S50TR IC REG LDO 5V 0.8A SOT223 LD3985M33R Ultra low drop-low noise BiCMOS voltage, regulators low ESR capacitors compatible LD_BICOLOR_CMS Bicolor Led LED Light-Emitting Diode LIS3MDL IC,Sensor LPS22HB IC,Sensor LSM6DSL Accelero + Gyro MEMS (6 Axis) LT1963EST-3.3 LT1963EST-3.3 LDO Low Noise 1.5A fast Transient Response M24SR64-Y M24SR64-Y 64K_EEPROM NFC/RFID MP34DT01 MEMS audio microphone MX25R6435F MX25R6435F Serial Flash Memory 64M PT Point de test RES Resistor SPBTLE-RF SPBTLE-RF SPSGRF SPSGRF-915or SPSGRF-868 ST890CDR 1.2 A current limited high-side power switch with thermal shutdown STM32F103CBT6 Medium-density performance
STM32L475VGT6单片机物联网开发板PDF原理图PCB+AD集成封装库文件, ALTIUM工程转的PDF原理图PCB文件+AD集成封装库,已在项目中验证,可以做为你的设计参考。集成封装库器件列表: Library Component Count : 46 Name Description ---------------------------------------------------------------------------------------------------- 1050170001 USB-MICRO-B, 1050170001, SMT, MOLEX 475900001 USB-MICRO-AB, 47590-0001, SMT, MOLEX BAT60JFILM BAT60JFILM BSR14 BSR14 NPN switching transistor SOT23 (Marking U8) CAP_NPOL Capacitor_not polarized EMIF02-USB03F2 2-line IPAD, EMI filter including ESD protection HEADER_2X5 HEADER_2X6_PMOD PMOD Connector Warning Specific Pinout HTS221 Humidity + Temp MEMS Header 10X1_Female_SMDHeader, 10-Pin, SMD, Single row,female Header 2 pins Header 2 pins Header 4 Header, 4-Pin Header 6X1_Female_SMDHeader, 6-Pin, SMD, Single row,female Header 8X1_Female_SMDHeader, 8-Pin, SMD, Single row,female ISM43362-M3G-L44 ISM43362-M3G-L44 Wifi Module 802.11 bgn Inductor Inductor LD1117S33TR LOW DROP FIXED AND ADJUSTABLE POSITIVE VOLTAGE REGULATORS (3.3 Volts) LD1117S50TR IC REG LDO 5V 0.8A SOT223 LD3985M33R Ultra low drop-low noise BiCMOS voltage, regulators low ESR capacitors compatible LD_BICOLOR_CMS Bicolor Led LED Light-Emitting Diode LIS3MDL IC,Sensor LPS22HB IC,Sensor LSM6DSL Accelero + Gyro MEMS (6 Axis) LT1963EST-3.3 LT1963EST-3.3 LDO Low Noise 1.5A fast Transient Response M24SR64-Y M24SR64-Y 64K_EEPROM NFC/RFID MP34DT01 MEMS audio microphone MX25R6435F MX25R6435F Serial Flash Memory 64M PT Point de test RES Resistor SPBTLE-RF SPBTLE-RF SPSGRF SPSGRF-915or SPSGRF-868 ST890CDR 1.2 A current limited high-side power switch with thermal shutdown STM32F103CBT6 Medium-density performance line ARM-based 32-bit MCU with 128KB Flas