样 机 测 试 报 告 "样机名称 " " "测试工程师 " " "测试开始日期 " " "测试结束日期 " " "审核 " " "批准 " " 1. 错误列表以及解决方案记录 2. 测试过程 2.1样机配置：设计BOM编号 "测试配置列表（通用配置，遵照可替代物料清单） " "主板 " " "BIOS版本 " " "驱动版本 " " "机箱 " " "显示器 " " "CPU " " "GPU " " "散热器 " " "硬盘 " " "DOM盘 " " "软驱仿真盘 " " "内存 " " "网卡 " " "显卡 " " "RAID卡 " " "HBA卡 " " "SCSI卡 " " "电源 " " "其他（PCI/PCI-E扩" " "展卡等） " " 2.1结构测试： "测试项目 "测试要求 "测试结果 " "考虑主板、机箱结构 "主板后I/O档片和机箱匹 " " " "配 " " " "机箱固定主板的孔位、螺" " " "柱（挡板）和主板正常配" " " "合 " " " "CPU支架能正常安装，和 " " " "机箱主板都无结构干涉 " " " "主板放入机箱中，不与机"

12V-115V/300W修正波逆变器详细资料，另有样机测试报告，可以根据此资料设计出逆变器。