AM335x核心板+TLV320AIC3106+USB2514B开发底板AD设计硬件原理图+PCB+主要器件技术手册资料，硬件开发板采用4层板设计，大小为128*195毫米，包括原理图及PCB，可以做为你的学习设计参考。 主要器件： MAX3232 MCP2551 OSCILLATOR PNP_S PWR2.5 Phonejack Stereo SW RJ45 Gigabit RJ45-1000M Res1 Resistor Res3 Resistor S9013 SD SN65HVD3082E SW DIP-1 SW-PB-4 Socket Socket Speaker Loudspeaker TLV320AIC3106 USB-V USB251X USB_OTG

EP4CE10F17C8 mini FPGA开发板PDF原理图+原理图库PCB封装库+器件技术手册资料" 74HC595.pdf AD9280.pdf AD9708.pdf AP3216C.pdf dht11-v1_3说明书(详细版).pdf DS18B20.pdf DVI V1.0.pdf HDMI Specification 13a.pdf HS0038B.pdf LAN8720A.pdf m24c64-r.pdf M25P16 datasheet.pdf MAX3232CSE.PDF max3483-max3491.pdf Part1_Physical_Layer_Simplified_Specification_Ver7.10.pdf PCF8563.pdf PCF8591.pdf Thumbs.db ug_altddio.pdf VESA VGA时序标准.pdf w25q16_datasheet.pdf w9825g6kh_a04.pdf wm8978.pdf xapp495_S6TMDS_Video_Interface.pdf pcb封装库： Component Count : 37 Component Name ----------------------------------------------- 3215 3225 AP3216C BUZZER C0603 CAP100 CR1220 D1206 DO214 EC6P3 F0805 FBGA256 FJ3661 HDR102 L2520 LED0603 R0603 R0805 SIP3-2P54 SIP4-2P54 SIP6-2P54 SOD323 SOD523 SOIC8-208 SOIC16 SOP8 SOT23 SOT23_S6 SOT23-6 SW_3_2X4_2 TFCARD TSOP54 TSOT-23-5 TSSOP16 WF_PAD XTAL_SMD XTAL-DIP

EP4CE10 cyclone4 FPGA开发板PDF原理图+ALTIUM原理图库PCB封装库+器件技术手册资料 74HC595.pdf AD9280.pdf AD9708.pdf AP3216C.pdf dht11-v1_3说明书(详细版).pdf DS18B20.pdf DVI V1.0.pdf HDMI Specification 13a.pdf HS0038B.pdf LAN8720A.pdf m24c64-r.pdf M25P16 datasheet.pdf MAX3232CSE.PDF max3483-max3491.pdf Part1_Physical_Layer_Simplified_Specification_Ver7.10.pdf PCF8563.pdf PCF8591.pdf Thumbs.db ug_altddio.pdf VESA VGA时序标准.pdf w25q16_datasheet.pdf w9825g6kh_a04.pdf wm8978.pdf xapp495_S6TMDS_Video_Interface.pdf 硬件PCB封装库列表： 3215 3225 AP3216C BUZZER C0603 CAP100 CON_2PIN CON_RA_HDMI_19P_0P5_SM CR1220 D1206 DB9-F DB15_VGA_S_F DIP-2X4-2P54 DIP-2X10_2P54 DIP-2X20_2P54 DO214 EAR_JACK EC6P3 F0805 FBGA256 FJ3661 FPC-40S-0P5SV HDR102 JACK-2_5MM_B JTAG_5X2_2P54_R L1040 L2520 LED0603 MIC_6X2_2 PH-1X2-2P0 QFN24 QFN32 R0603 R0805 RJ45 RM065-V1 SIP3-2P54 SIP4-2P54 SIP6-2P54 SMC SOD323 SOD523 SOIC8-208 SOIC8E SOIC16 SOIC16W_1R27_10R3X10R33 SOP8 SOT23 SOT23_S6 SOT23-6 SW4_PB_ESW_SM_P177 SWITCH_DDSZ T4R2-6R2_BOTSMT T4R2-6R2_TOPSMT TFCARD TSOP54 TSOT-23-5 TSSOP16 TYPE-C-31-M-12 WF_PAD XTAL_SMD XTAL-DIP

STM32F407单片机开发板PDF原理图+AD集成封装库+主要器件技术手册资料: 器件手册： AMS1117.pdf AT24C02.pdf CH340.pdf DHT11.pdf DS1820.pdf DS18B20.pdf ET2046.pdf GT811.pdf GT9147数据手册.pdf GT9147编程指南.pdf IS62WV51216.pdf K4S641632.pdf LAN8720A.pdf MAXII(EPM570).pdf MP2359 AN.pdf MP2359.pdf MP3302_r0.98.pdf nRF24L01P(新版无线模块控制IC).PDF OTT2001A IIC协议指导.pdf OTT2001A_V02.pdf OV2640.pdf OV2640_DS(1.6).pdf OV7670.pdf OV7670_英文.pdf PAM3101DAB28.pdf RT9193.pdf SMBJ3.3-440_series.pdf SMBJ5.0ca.pdf SN74LVC1G00.pdf SP3232.pdf SP3485.pdf STM32F407ZGT6.pdf TJA1050.pdf W25Q128.pdf WM8978G.pdf WM8978中文资料.doc XPT2046.pdf AD集成封装库列表： Library Component Count : 54 Name Description ---------------------------------------------------------------------------------------------------- 24C256 AMS1117 ATK-HC05 ATK-HC05 BAT BEEP BUTTON C CAP CH340G USB2UART D DB9 DHT11 数字温湿度传感器 HEAD2 HEAD2*22 HR911105 HS0038 Header 16 Header, 16-Pin Header 2 Header, 2-Pin Header 2X2 Header, 2-Pin, Dual row Header 3X2 Header, 3-Pin, Dual row Header 4 Header, 4-Pin Header 9X2 Header, 9-Pin, Dual row IS62WV51216 JTAG KEY_M L LAN8720 ETH PHY LED2 Typical RED, GREEN, YELLOW, AMBER GaAs LED LSENS LIGHT SENS L_SOP MAX3232 MAX3485 MIC MOS-P IRLML6401/SI2301 MP2359 DC DC Step Down IC MPU6050 9轴运动处理传感器 NPN 8050/BCW846/BCW847 NRF24L01 PHONE_M PNP 8550/BCW68 POW R SMBJ TVS SN65HVD230D STM32F407ZET6 STM32F407ZET6 TEST-POINT 测试点 TFT_LCD TPAD ALIENTEK TPAD USB5 USB_A_90 USB-A-90 W25X16