Realtek PCIe GBE Family Controller WIN7/WIN2008 驱动
支持32/64位，WIN2008数据中心版亲测通过
2019-12-29 03:19:28
5.78MB
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xilliix pcie dma 驱动 （基于 xilnx xdma ip核 4.0 的WDF驱动）
---
# XDMA Windows Driver
This project is Xilinx's sample Windows driver for 'DMA/Bridge Subsystem for PCI Express v4.0' (XDMA) IP.
*Please note that this driver and associated software are supplied to give a basic generic reference
implementation only. Customers may have specific use-cases and/or requirements for which this driver
is not suitable.*
### Dependencies
* Target machine running Windows 7 or Windows 10
* Development machine running Windows 7 (or later)
* Visual Studio 2015 (or later) installed on development machine
* Windows Driver Kit (WDK) version 1703 (or later) installed on development machine
## Directory Structure
```
/
|__ build/ - Generated directory containing build output binaries.
|__ exe/ - Contains sample client application source code.
| |__ simple_dma/ - Sample code for AXI-MM configured XDMA IP.
| |__ streaming_dma/ - Sample code for AXI-ST configured XDMA IP.
| |__ user_events/ - Sample code for access to user event interrupts.
| |__ xdma_info/ - Utility application which prints out the XDMA core ip
| | configuration.
| |__ xdma_rw/ - Utility for reading/writing to/from xdma device nodes such
| | as control, user, bypass, h2c_0, c2h_0 etc.
| |__ xdma_test/ - Basic test application which performs H2C/C2H transfers on
| all present channels.
|__ inc/ - Contains public API header file for XDMA driver.
|__ libxdma/ - Static kernel library for XDMA IP.
|__ sys/ - Reference driver source code which uses libxdma
|__ README.md - This file.
|__ XDMA.sln - Visual Studio Solution.
```
2019-12-24 03:22:06
86KB
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Windows 2000XP WDM设备驱动程序开发 第二版 pdf电子书和附属光盘中所有的源代码。个人找了好久，才把书和代码找齐。一起发出来，一次下载就可以开发驱动了。
里面有很多直接可以用的驱动源码，usb和pci驱动需要根据硬件稍作修改就可以用。
在此多谢本书作者！
2019-12-21 22:25:07
38.41MB
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PCIe规范各版本合集，包括1.0a、2.0、2.1、3.0四个版本，调试pcie必备资料，给大家分享一下。
2019-12-21 22:20:55
13.39MB
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PEX8619-BA50BIG是PLX公司的第二代PCIe交换器芯片，包括16个端口，每端口最高速率为5GT/s，端口灵活可配置成ｘ1、ｘ2、ｘ4、ｘ8模式,支持硬件和软件配置，支持DMA，NT等特性，支持PCIe 2.0规范，后向兼容PCIe1.0,1.1规范,典型功耗1.99W,BGA324封装,无铅工艺。
尺寸19mmx19mmx1.9mm
工作电压：Vcore=Vserdes=1.0V±5%;Vio=Vpll=2.5V±10%;
温度：-40℃～85℃
热阻抗:ΘJC=4.78℃/W,ΘJA=16.21℃/W@ 4 layer
主要应用：板内各个高速接口间高速数据交换
2019-12-21 22:20:45
15.72MB
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