虚拟电路实验室 基于Web的虚拟电路实验室的后端。 它是使用Python和Flask构建的。 请参考我们的前端，位于 。 要安装必需的软件包 仅适用于PySpice PyCharm： 设置->项目-> Python解释器： 安装： PySpice 在命令行上运行以下命令： pyspice-post-installation --install-ngspice-dll pyspice-post-installation --check-install 跑步 运行app.py 有关其他步骤，请参阅的说明。 去测试 使用发送HTTP请求和接收HTTP响应。 PySpice文档 请参考 。 致谢 除了SPICE功能之外，该后端代码结构是基于我们在Udemy的公开在线课程中研究的模板构建的，该课程由Teclado的Jose Salvatierra提供。该课程可以在这里找到： ://www.u

最近的邻居和回溯Python实现 最接近邻居和回溯算法的python实现，以便找到权重最小的汉密尔顿电路。 该代码和报告是作为2018年Spring离散数学课程的一部分编写的。其概念是飞越Jupyter的7颗卫星，然后返回家中。 :rocket: :milky_way: 。 查看报告以获取更多信息。

MICROWAVE CIRCUITS

Systematic Design of Analog CMOS Circuits

This manuscript is based on the dissertation entitled ”Microwave Circuits for 24 GHz Radar Front-End Applications in CMOS and Bipolar Technologies” submitted to the University of Paderborn. 本资源仅用于学习和交流用,请于下载后24小时自行删除.

Foundations of Analog and Digital Electronic Circuits.pdfFoundations of Analog and Digital Electronic Circuits.pdfFoundations of Analog and Digital Electronic Circuits.pdfFoundations of Analog and Digital Electronic Circuits.pdfFoundations of Analog and Digital Electronic Circuits.pdfFoundations of Analog and Digital Electronic Circuits.pdf

印刷电路板手册第六版 Part 1 Lead-Free Legislation Chapter 1. Legislation and Impact on Printed Circuits 1.3 1.1 Legislation Overview / 1.3 1.2 Waste Electrical and Electronic Equipment (WEEE) / 1.3 1.3 Restriction of Hazardous Substances (RoHS) / 1.3 1.4 RoHS’ Impact on the Printed Circuit Industry / 1.6 1.5 Lead-Free perspecives / 1.10 1.6 Other Legislative Initiatives / 1.10 Part 2 Printed Circuit Technology Drivers Chapter 2. ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY 2.3 2.1 Introduction / 2.3 2.2 Measuring the Interconnectivity Revolution (HDI) / 2.3 2.3 Hierarchy of Interconnections / 2.6 2.4 Factors Affecting Selection of Interconnections / 2.7 2.5 ICS and Packages / 2.10 2.6 Density Evaluations / 2.14 2.7 Methods to Increase PWB Density / 2.16 References / 2.21 Chapter 3. Semiconductor Packaging Technology 3.1 3.1 Introduction / 3.1 3.2 Single-Chip Packaging / 3.5 3.3 Multichip Packages / 3.15 3.4 Optical Interconnects / 3.18 3.5 High-Density/High-Performance Packaging Summary / 3.21 3.6 Roadmap Information / 3.21 References / 3.21 Chapter 4. Advanced Component Packaging 4.1 4.1 Introduction / 4.1 4.2 Lead-Free / 4.2 4.3 System-on-a-Chip (SOC) versus System-on-a-Package (SOP) / 4.3 v For more information about this title, click here 4.4 Multichip Modules / 4.5 4.5 Multichip Packaging / 4.6 4.6 Enabling Technologies / 4.10 4.7 Acknowledgment / 4.18 References / 4.18 Chapter 5. Types of Printed Wiring Boards 5.1 5.1 Introduction / 5.1 5.2 Classification of Printed Wiring Boards / 5.1 5.3 Organic and Nonorganic Substrates / 5.3 5.4 Graphical and Discrete-Wire Boards / 5.3 5.5 Rigid and Flexible Boards / 5.5 5.6 Graphically Produced Boards / 5.6 5.7 Molded Interconnection Devices / 5.10 5.8 Plated-Through-Hole (PTH) Technologies / 5.10 5.9 Summary / 5.13 References / 5.14 Part 3 Materials Chapter 6. Introduction to Base Materials 6.3 6.1 Introduction / 6.1 6.2 Grades and Specifications / 6.3 6.3 Properties Used to Classify Base Materials / 6.9 6.4 Types of F

Contents Preface page xiii 1 Introduction 1 1.1 RF circuits 2 1.2 Narrowband nature of RF signals 3 1.3 AC circuit analysis – a brief review 3 1.4 Impedance and admittance 4 1.5 Series resonance 4 1.6 Parallel resonance 5 1.7 Nonlinear circuits 5 Problems 5 2 Impedance matching 10 2.1 Transformer matching 11 2.2 L-networks 12 2.3 Higher Q – pi and T-networks 14 2.4 Lower Q – the double L-network 15 2.5 Equivalent series and parallel circuits 16 2.6 Lossy components and efficiency of matching networks 16 Problems 17 3 Linear power amplifiers 19 3.1 Single-loop amplifier 19 3.2 Drive circuitry: common-collector, common-emitter, and common-base 20 3.3 Shunt amplifier topology 22 3.4 Dual-polarity amplifiers 22 3.5 Push–pull amplifiers 23 3.6 Efficiency calculations 25 3.7 AC amplifiers 26 3.8 RF amplifiers 29 3.9 Matching a power amplifier to its load 31 Problems 31 4 Basic filters 34 4.1 Prototype lowpass filter designs 35 4.2 A lowpass filter example 36 4.3 Lowpass-to-bandpass conversion 38 Appendix 4.1 Component values for normalized lowpass filters 41 Problems 43 References 45 5 Frequency converters 46 5.1 Voltage multiplier as a mixer 46 5.2 Switching mixers 48 5.3 A simple nonlinear device as a mixer 51 Problems 53 6 Amplitude and frequency modulation 54 6.1 Amplitude modulation 55 6.2 Frequency and phase modulation 58 6.3 AM transmitters 62 6.4 FM transmitters 65 6.5 Current broadcasting practice 65 Problems 66 7 Radio receivers 67 7.1 Amplification 67 7.2 Crystal sets 68 7.3 TRF receivers 68 7.4 The superheterodyne receiver 69 7.5 Noise blankers 74 7.6 Digital signal processing in receivers 75 Problems 75 References 76 8 Suppressed-carrier AM and quadrature AM (QAM) 77 8.1 Double-sideband suppressed-carrier AM 77 8.2 Single-sideband AM 78 8.3 Product detector 80 8.4 Generation of SSB 81 8.5 Single-sideband with class C, D, or E amplifiers 83 8.6 Quadrature AM (QAM) 84 Problems 85 References 86 9 Class-C, D, and E Power RF amplifiers 87 9.1 The class-C amplifier

电子工程英文原版书籍 光纤通信集成电路设计

Sym-CTS 介绍 Sym-CTS是我的毕业设计，旨在为近阈值电压（NTV）或超低压（ULV）集成电路设计设计对称时钟树。 由于时钟缓冲器和时钟门的时序变化，在NTV上工作的电路会有很大的变化，并且时钟树的性能可能会大大降低。 对称时钟树综合（CTS）是在NTV或ULV下实现稳健时钟树设计的有效方法。 该项目当前基于Python3.7。 警告：存储库已准备好迁移到Rust版本。 Sym-CTS流程大纲 划分 施工 正在缓冲 缓冲区大小 编程原理 面向对象编程 可配置的 可重用 如何使用 准备工具 python3和3rd-party软件包：numpy，pandas，scipy gnuplo