TSUPREM-4 is a computer program for simulating the processing steps used in the manufacture of silicon integrated circuits and discrete devices. TSUPREM-4 simulates the incorporation and redistribution of impurities in a two-dimensional (2-D) device cross-section perpendicular to the surface of the silicon wafer. The output information provided by the program includes:
• Boundaries of the various layers of materials in the structure
• Distribution of impurities within each layer
• Stresses produced by oxidation, thermal cycling, or film deposition
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