Altium Designer AD 封装库 常用线路板PCB库 带3D模型 ssop芯片封装库 常用封装
2023-02-23 12:17:02
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Preface
Printed Circuit Board Design Techniques for EMC Compliance: A
Handbook for Designers, Second Edition, is a significant enhancement to
the first edition. The first edition was well received within the engineering
community worldwide and was translated into international languages. The
intent of the present volume is to expand upon concepts presented in the
earlier edition, to justify why a specific design technique works, and to
show when it is appropriate for use. Additional techniques based on
technological changes within the last few years are also incorporated.
These techniques and enhancements are based on questions, comments,
and discussions received from engineers around the world.
This book presents information never before published within the
engineering community, dealing exclusively with printed circuit boards
(PCBs). When writing the first edition, it was impossible to anticipate the
amount of variations possible, or what the intended audience expected
from a book directed toward nondegreed engineers. A thorough
understanding of the concepts presented herein will assist during the
design and layout process. Note the key word here —"concepts."
Printed Circuit Board Design Techniques for EMC Compliance will help
minimize the emission or reception of unwanted radio frequency (RF)
energy generated by components and circuits, thus achieving acceptable
levels of electromagnetic compatibility (EMC) for electrical equipment. The
field of EMC consists of two distinct areas:
1. Emissions: Propagation of electromagnetic interference (EMI) from
noncompliant devices (culprits) and, in particular, radiated and
conducted electromagnetic interference.
2. Susceptibility or immunity: The detrimental effects on susceptible
devices (victims) in forms that include EMI, electrostatic discharge
(ESD), and electrical overstress (EOS).
The primary goal of the engineer is to ensure proper operation and
performance of a product when used within an intended electromagnetic
environment. These design requirements are in addition to making a
product function as desired for use within a specific, end-use environment.
Information presented in this guideline is intended for those who design
and layout printed circuit boards. EMC and compliance engineers will also
find the information presented herein helpful in solving design problems at
both the PCB and system level. This book can be used as a reference
document for any design project.
The focus of this book is strictly on the PCB. Containment techniques
(shielding), internal and external cabling, power supply design, and other
system-level subassemblies that use PCBs as a subcomponent will not be
discussed. Again, as in the first edition, excellent reference material on
these aspects of EMC system-level engineering is listed in the References
section at the ends of chapters.
2023-02-23 06:17:28
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柔性电路板或者软硬结合板的制造文件
在上一期关于软硬结合印刷电路板的博客中，我谈到了制板商制造柔性板的典型工艺流程。了解制造工艺，对于设计软硬结合板或者柔性电路板是十分重要的。同时，它也告诉你成功地制造设计的板子所提供的数据。如果你还没有阅读过该系列博客的第1部分和第2部分，赶紧在这里和这里阅读，然后继续下文。
制造文件
让我们来谈谈制造文件，它们非常重要。我们是通过制造文件告诉生产商我们想要什么的，然而它们也是造成理解错误或者失误，而导致高昂代价的延误的重要因素。幸运的是，我们可以参考一些标准，来确保我们与制造厂之间沟通无碍，尤其是IPC
2023-02-22 23:06:15
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CC2530无线模块设计（含原理图、PCB、部分测试代码） CC2530无线模块设计（含原理图、PCB、部分测试代码）
2023-02-21 19:29:44
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Cadence Allegro如何正确导入PADS PCB，PCB资料各种软件之间的转换教程参考
2023-02-21 11:04:19
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