Advanced Mezzanine Card Base Specification
- 1.Introduction
- 2.Mechanical
- 3.Hardware Platform Management
- 4.Power Distribution
- 5.Thermal
- 6.Interconnect
- 7.AMC Connector
- Appendix A. AMC mating conditions
- Appendix B. Signal integrity analysis and guidelines
- Appendix C. Regulatroy Standards
- Appendix D. Module Handle designs
- Appendix E. Requirements Index
2021-08-11 12:11:53
6.6MB
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2021-07-28 11:28:42
16.87MB
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PICMG_COM_0R3_0/ COMe Express R3.0/COMe 3.0 Spec
COMe3.0 COMe COMeExpress 原版电子版标准 R3.0
2021-06-18 14:09:16
1.37MB
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PICMG_COME规范，2篇文档，Base Specification和Short Form Specification
一个166页，一个31页，
文字版不是扫描版
2021-05-29 14:02:44
2.26MB
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CompactPCI ® Express Specification Revision 2.0 英文原版官方规范
March 22, 2013
一级目录
1 Introduction
2 Mechanical Requirements
3 Electrical Requirements
4 Keying Requirements
2021-05-26 14:24:46
4.7MB
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PC总线的演进
PICMG 1.x PCI/ISA/PIC-X无源背板规9PICMG 2.x CompactPCI规范
CompactPCI Express& PXI Express
2021-05-25 21:00:43
4.22MB
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PICMG® 3.1 Revision 3.0 Specification
Ethernet/Fibre Channel for AdvancedTCA® Systems
Revision 3.0 - May 5, 2016
2021-05-16 20:09:01
3.61MB
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PICMG_COMDG_2.0-RELEASED，应用于COMe Type6和Type10的载板官方规范
2021-04-30 20:23:47
2.79MB
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